The EU-SIPhoDiAS project deals with the development of critical photonic building blocks needed for highperformance and low size, weight, and power (SWaP) photonics-enabled Very High Throughput Satellites (VHTS). In this presentation, we report on the design and fabrication activities during the first year of the project concerning the targeted family of digital and microwave photonic components. This effort aims to demonstrate components of enhanced reliability at technology readiness level (TRL) 7. Specifically, with respect to microwave photonic links, we report: (i) the design of Ka and Q-bands analogue photodetectors that will be assembled in compact packages, allowing for very high bandwidth per unit area and (ii) on the design of compact V-band GaAs electro-optic modulator arrays, which use a folded-path optical configuration to manage all fiber interfaces packaged opposite direct in-line RF feeds for ease of board layouts and mass/size benefits. With respect to digital links, we report on the development of 100 Gb/s (4 x 25 Gb/s) digital optical transceiver sub-assemblies developed using flip-chip mounting of electronic and opto-parts on a high-reliability borosilicate substrate. The transceiver chipset developed specifically for this project refers to fullycustom 25 Gb/s radiation hard (RH) VCSEL driver and TIA ICs designed in IHP’s 130 nm SiGe BiCMOS Rad-Hard process.
A 110-170 GHz transceiver is designed and fabricated in a 130 nm SiGe BiCMOS technology. The transceiver operates as an amplifier for transmitting and simultaneously as a fundamental mixer for receiving. In a measured frequency range of 120-160 GHz, a typical output power of 0 dBm is obtained with an input power of +3 dBm. As a fundamental mixer, a conversion gain of -9 dB is obtained at 130 GHz LO, and a noise figure of 19 dB is achieved. The transceiver is successfully demonstrated as a FMCW radar front-end for distance measurement. With a chirp rate of 1.6×1012 Hz/s and a bandwidth of 14.4 GHz, a range resolution of 2.8 cm is demonstrated, and transmission test is shown on different objects.
We present our recent work on high-speed optical interconnects with advanced modulation formats and directly modulated 850 nm VCSELs. Data transmission at nearly 100 Gbps was achieved with 4-PAM. Forward error correction, equalization and preemphasis are also explored. The system aspects of the advanced modulation formats and their impact on the VCSEL requirements are discussed. Requirements on the optical output power, frequency response and the relative intensity noise are discussed. Finally, co-optimization of the VCSELs and VCSEL driver amplifiers in CMOS and InP technologies is discussed.
This paper presents a pre-amplified detector receiver based on a 250 nm InP/InGaAs/InP double heterojunction bipolar transistor (DHBT) process available from the Teledyne scientific. The front end consists of a double slot antenna followed by a five stage low noise amplifier and a detector, all integrated onto the same circuit. Results of measured responsivity and noise are presented. The receiver is characterized through measuring its response to hot (293) and cold (78) K terminations. Measurements of the voltage noise spectrum at the video output of the receiver are presented and can be used to derive the temperature resolution of the receiver for a specific video bandwidth.
KEYWORDS: Antennas, Receivers, Radar, Transmitters, Manufacturing, Gallium arsenide, Interference (communication), Waveguides, Signal to noise ratio, Near field
The development of a 210 GHz radar system intended to study security applications such as personnel scanning is reported.
The system is designed to operate with a transmit antenna floodlighting the target scene and a mechanically
scanned antenna-integrated receiver module. For increased performance and potential future volume production the receiver
front-end is based on highly integrated MMICs manufactured using the IAF 0.1 μm GaAs mHEMT process made
available through a Swedish-German MoU. A single-chip MMIC solution is being developed containing feed antenna,
LNA, mixer and an LO multiplier-chain. The transmitter part is based on a high-power HBV quintupler source-module.
Noise parameters of AlGaAs/GaAs and InGaP/GaAs HBTs were measured in microwave frequency range and modeled using the small-signal equivalent circuit approach. Correlated current noise sources in the base and collector currents with thermal noise in the circuit resistive elements were accounted for by the model and yielded good agreement with the measured data. This enabled an extraction of the different noise source contributions to minimum noise figure (NFmin) in AlGaAs/GaAs and InGaP/GaAs HBTs. Decomposition of the (NFmin) in to the different contributors showed that the main noise sources in investigated HBTs are correlated base and collector current shot noise. The observed minimum of NFmin versus frequency at lower collector current is explained by the reduction of the emitter/base junction shot noise component due to the spike in the emitter/base junction and associated accumulation of the quasi-thermalized electrons forming a space charge, which screens the electron transfer through the barrier. The bias (VCE) increase creates an efficient electric field in collector/base junction, capable of 'washing out' the accumulated charge. Such shot noise reduction in HBTs could be exploited in the LNA for the RF application.
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