Dr. Hong Xiao Profile

Dr. Hong Xiao

Sr. E-beam and Processing Expert

SPIE Involvement:

Author | Instructor

Area of Expertise:

Semiconductor manufacturing process technologies , Electron beam defect inspection , Electron beam defect review , Applications of SEM in IC chip manufacturing , IC chip manufacturing technology trends

Dr. Hong Xiao is the Sr. e-beam and processing expert of ASML with expertise in e-beam applications in defect inspection, defect review, and CDU and overlay metrologies of IC chip manufacturing processes. He worked as e-beam technologist of KLA Corp.; technical marketing specialist of Hermes-Microvision, Inc.; and technical manager of Hermes Epitek Corp. He was a Sr. process engineer in Motorola; associate professor of Austin Community College; and Sr. technical instructor of Applied Materials. He received the Ph.D. in physics from the University of Texas at Austin, Dr. Xiao authored and co-authored over 30 journal and conference papers. He has more than 30 patents in US and other countries. He is the author of textbooks, “Introduction to Semiconductor Manufacturing Technology” the 2nd edition published by SPIE Press in Dec. 2012 and “3D IC Devices, Technologies, and Manufacturing” published by SPIE Press in 2016. He is a member of SPIE since 2005 and lifetime member of Chinese American Semiconductor Professional Association.

SPIE Press Book | 29 April 2016

3D IC Devices, Technologies, and Manufacturing

Hong Xiao

KEYWORDS: Photomasks, Etching, Silicon, Oxides, Semiconducting wafers, Metals, Dielectrics, Tin, Manufacturing

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3D IC Devices, Technologies, and Manufacturing

Proceedings Article | 18 April 2013 Paper

Capturing buried defects in metal interconnections with electron beam inspection system

Hong Xiao, Ximan Jiang, Paul MacDonald, Mike Van Riet, Chris Maher, Olivier Moreau, David Trease, Shishir Ramprasad, Anadi Bhatia, Pierre Lefebvre, David Bastard, Cecelia Campochiaro

Proceedings Volume 8681, 86810F (2013) https://doi.org/10.1117/12.2011162

KEYWORDS: Copper, Metals, Scanning electron microscopy, Semiconducting wafers, Monte Carlo methods, Tungsten, Virtual colonoscopy, Transmission electron microscopy, Inspection, Chemical mechanical planarization

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SPIE Press Book | 19 November 2012

Introduction to Semiconductor Manufacturing Technology, Second Edition

Hong Xiao

KEYWORDS: Semiconducting wafers, Etching, Silicon, Oxides, Metals, Dielectrics, Ions, Plasma, Copper, Photoresist materials

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Introduction to Semiconductor Manufacturing Technology, Second Edition

Proceedings Article | 28 April 2011 Paper

High-throughput critical dimensions uniformity (CDU) measurement of two-dimensional (2D) structures using scanning electron microscope (SEM) systems

Derek Tomlinson, Hong Xiao, Theodorus Standaert, Jack Jau, Jennifer Fullam, Wei Fang, Long Ma, Carol Boye, John Gaudiello, Yan Zhao, Xu Zhang, Fei Wang

Proceedings Volume 7971, 79710Y (2011) https://doi.org/10.1117/12.879910

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Scanning electron microscopy, Inspection, Electron microscopes, Defect inspection, Data acquisition, Etching, Field effect transistors

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Proceedings Article | 7 April 2011 Paper

Demonstration of defect free EUV mask for 22nm NAND flash contact layer using electron beam inspection system

Yan Zhao, Satoshi Kawashima, Yuichi Inazuki, Chiyan Kuan, Hong Xiao, Long Eric Ma, Hiroshi Mohri, Jack Jau, Tadahiko Takikawa, Tsukasa Abe, Fei Wang, Naoya Hayashi, Takeya Shimomura

Proceedings Volume 7969, 79691B (2011) https://doi.org/10.1117/12.879565

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Extreme ultraviolet lithography, Defect detection, Lithography, Manufacturing, Particles, Electronic components, Opacity

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Proceedings Article | 25 September 2010 Paper

Native pattern defect inspection of EUV mask using advanced electron beam inspection system

Jack Jau, Naoya Hayashi, Tadahiko Takikawa, Hiroshi Mohri, Fei Wang, Chiyan Kuan, Yan Zhao, Tsukasa Abe, Long Ma, Yuichi Inazuki, Takeya Shimomura, Hong Xiao

Proceedings Volume 7823, 78232B (2010) https://doi.org/10.1117/12.868171

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Defect inspection, Bridges, Opacity, Defect detection, Scanning electron microscopy, Optical inspection, Extreme ultraviolet lithography

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Proceedings Article | 2 April 2010 Paper

After development inspection defectivity studies of an advanced memory device

Eric Ma, Hyung-Seop Kim, Byoung-Ho Lee, Yan Zhao, Kenichi Kanai, Fei Wang, Jack Jau, Hong Xiao

Proceedings Volume 7638, 76380L (2010) https://doi.org/10.1117/12.848066

KEYWORDS: Inspection, Critical dimension metrology, Reticles, Optical inspection, Semiconducting wafers, Defect inspection, Bridges, Wafer inspection, Finite element methods, Optical lithography

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Proceedings Article | 11 December 2009 Paper

EUV mask pattern inspection with an advanced electron beam inspection system

Fei Wang, Long Ma, Yuichi Inazuki, Naoya Hayashi, Takeya Shimomura, Yasutaka Morikawa, Hiroshi Mohri, Jack Jau, Tadahiko Takikawa, Hong Xiao, Abe Tsukasa, Chiyan Kuan, Yan Zhao

Proceedings Volume 7520, 75201D (2009) https://doi.org/10.1117/12.837025

KEYWORDS: Inspection, Extreme ultraviolet, Photomasks, Scanning electron microscopy, Defect detection, Opacity, Extreme ultraviolet lithography, Bridges, Silicon, Solids

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Proceedings Article | 11 December 2009 Paper

After development inspection (ADI) studies of photo resist defectivity of an advanced memory device

Hong Xiao, Jack Jau, Yan Zhao, Fei Wang, Kenichi Kanai, Eric Ma, Hyung-Seop Kim, Byoung-Ho Lee, Yong Min Cho, Roland Yeh

Proceedings Volume 7520, 75200J (2009) https://doi.org/10.1117/12.837103

KEYWORDS: Inspection, Reticles, Semiconducting wafers, Optical inspection, Bridges, Wafer inspection, Defect inspection, Finite element methods, Scanning electron microscopy, Optical lithography

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Proceedings Article | 30 September 2009 Paper

Study of program defects of 22nm nanoimprint template with an advanced e-beam inspection system

Masaaki Kurihara, Hong Xiao, Jack Jau, Nobuhito Toyama, Chiyan Kuan, Long Ma, Hiroshi Mohri, Takaaki Hiraka, Yan Zhao, Jun Mizuochi, Satoshi Yusa, Shiho Sasaki, Yasutaka Morikawa, Yuko Nakanishi, Naoya Hayashi, Fei Wang

Proceedings Volume 7488, 74880T (2009) https://doi.org/10.1117/12.834581

KEYWORDS: Inspection, Nanoimprint lithography, Photomasks, Quartz, Vestigial sideband modulation, Defect inspection, Image processing, Manufacturing, Electronic components, Beam shaping

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Proceedings Article | 23 September 2009 Paper

Inspection of 32nm imprinted patterns with an advanced e-beam inspection system

Kosta Selinidis, Fei Wang, Ecron Thompson, Long Ma, Jack Jau, S. V. Sreenivasan, Hong Xiao, Yan Zhao, Douglas Resnick

Proceedings Volume 7488, 74881V (2009) https://doi.org/10.1117/12.833419

KEYWORDS: Inspection, Photomasks, Nanoimprint lithography, Electron beam lithography, Semiconducting wafers, Lithography, Defect inspection, Dysprosium, Scanning electron microscopy, Optical lithography

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Proceedings Article | 23 March 2009 Paper

Study of devices leakage of 45nm node with different SRAM layouts using an advanced e-beam inspection systems

Hong Xiao, Long Ma, Jack Jau, Yan Zhao

Proceedings Volume 7272, 72721E (2009) https://doi.org/10.1117/12.813885

KEYWORDS: Inspection, Semiconducting wafers, Etching, Oxides, Transmission electron microscopy, Nickel, Defect inspection, Manufacturing, Field effect transistors, Silicon

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Proceedings Article | 5 April 2007 Paper

Contact leakage and open monitoring with an advanced e-beam inspection system

Hong Xiao, Shuen-chen Lei, Hung-Chi Wu, Mingsheng Tsai, Jack Jau, Hermes Liu

Proceedings Volume 6518, 65184I (2007) https://doi.org/10.1117/12.711761

KEYWORDS: Inspection, Virtual colonoscopy, Transmission electron microscopy, Defect inspection, Semiconducting wafers, Oxides, Scanning electron microscopy, Tungsten, Defect detection, Sensors

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Proceedings Article | 24 March 2006 Paper

Leakage monitoring and control with an advanced e-beam inspection system

J. Y. Kao, S. F. Tzou, Hermes Liu, Hong Xiao, S. C. Lei, Chan Lon Yang, Mingsheng Tsai, Jack Jau, Y. D. Yang, Wei-Yih Wu, J. H. Yeh, Hong-Chi Wu

Proceedings Volume 6152, 615249 (2006) https://doi.org/10.1117/12.656207

KEYWORDS: Semiconducting wafers, Inspection, Scanning electron microscopy, Diffusion, Nickel, Tungsten, Defect detection, Failure analysis, Control systems, Defect inspection

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Proceedings Article | 24 March 2006 Paper

High-throughput contact critical dimension and gray level value measurement

Kai Wang, Yan Zhao, Jack Jau, Darren Wong, Hong Xiao, Wei Fang, Mark Huang

Proceedings Volume 6152, 61523L (2006) https://doi.org/10.1117/12.656978

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Bismuth, Finite element methods, Etching, Image processing, Inspection, Sensors, Photomasks

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Proceedings Article | 24 March 2006 Paper

High-resistance W-plug monitoring with an advance e-beam inspection system

Y. D. Yang, Hermes Liu, Hong Xiao, Wei-Yih Wu, S. C. Lei, Mingsheng Tsai, J. Y. Kao, Hong-Chi Wu, J. H. Yeh, Chan Lon Yang, S. F. Tzou, Jack Jau

Proceedings Volume 6152, 61524A (2006) https://doi.org/10.1117/12.656217

KEYWORDS: Inspection, Scanning electron microscopy, Semiconducting wafers, Transmission electron microscopy, Defect detection, Resistance, Electron microscopes, Tungsten, Failure analysis, Electron beams

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Showing 5 of 16 publications

Course Instructor

SC1009: Introduction to Scanning Electron Microscope (SEM) Applications of Defect Inspection and Review in IC Manufacturing

This course explains basic principles and applications of defect electron beam inspection (EBI) and defect e-beam review (EBR). The primary goals of the course are to describe the basic of SEM imaging, defect behavior in the SEM image, case studies of EBI and EBR applications in semiconductor process development and high-volume manufacturing (HVM). Basics principles of design for inspection (DFI) and some case studies of EBI test circuit design are also covered.

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