Mr. Hongfei Yang Profile

Hongfei Yang

at Shanghai Institute of Technical Physics CAS

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 8 March 2017 Paper

Design of three-dimensional imaging system based on SFM

Hongfei Yang, Xin Chen, Peng Rao

Proceedings Volume 10255, 102550K (2017) https://doi.org/10.1117/12.2268681

KEYWORDS: 3D image processing, Imaging systems, 3D image reconstruction, Sensors, 3D modeling, Image processing, Image compression, Image segmentation, 3D acquisition, Cameras

Read Abstract +

For the prospects of three-dimensional reconstruction technology based on structure from motion in engineering application, a high-resolution and visible band imaging system has been designed and implemented. It consists of a 5k × 5k CMOS focal plane array detector made by the ON-SEMI company, an optical system and an electronics system designed by ourselves. The electronics system takes FPGA as the control and drive processor chip and is divided into three parts: a power management module, a detector module and an image processing module, capable of finishing image compression and transmission. A sequence of images for the target of long distance away is obtained from the imaging system and the images after cropping and segmentation, aiming at reducing calculation and excluding some points irrelevant with the target during reconstruction process, are took as input of structure from motion. Seeds from the match points expand from sparse points to dense points and the initial model of reconstruction target is achieved. The experiment results show that the imaging system meet the requirement of three-dimensional reconstruction in engineering application and a new novel imaging system design of graded resolution based on bionics is proposed.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years