Dr. Hongtao Han
at Shenzhen O-Film Technologies Co Ltd
SPIE Involvement:
Author
Publications (5)

Proceedings Article | 3 December 2009 Paper
Proc. SPIE. 7631, Optoelectronic Materials and Devices IV
KEYWORDS: Semiconducting wafers, Wafer-level optics, Cameras, Optics manufacturing, Image sensors, Wafer bonding, Integrated optics, Packaging, Cell phones, Glasses

Proceedings Article | 30 April 1999 Paper
Proc. SPIE. 3631, Optoelectronic Integrated Circuits and Packaging III
KEYWORDS: Silicon, Semiconducting wafers, Sensors, Packaging, Optical alignment, Wafer-level optics, Optical components, Vertical cavity surface emitting lasers, Active optics, Optics manufacturing

Proceedings Article | 30 April 1999 Paper
Proc. SPIE. 3631, Optoelectronic Integrated Circuits and Packaging III
KEYWORDS: Silicon, Optical fibers, Optical arrays, Micro optics, Integrated optics, Optics manufacturing, Fiber optics, Diffractive optical elements, Optical alignment, Etching

Proceedings Article | 20 September 1996 Paper
Proc. SPIE. 2893, Fiber Optic Components and Optical Communication
KEYWORDS: Silicon, Etching, Switches, Optical fibers, Optical alignment, Optical switching, Anisotropic etching, Optoelectronics, Optical arrays, Crystals

Proceedings Article | 29 March 1996 Paper
Proc. SPIE. 2691, Optoelectronic Packaging
KEYWORDS: Silicon, Optical alignment, Etching, Reactive ion etching, Semiconducting wafers, Manufacturing, Photomicroscopy, Fiber to the x, Optoelectronic packaging, Tolerancing

Conference Committee Involvement (1)
Photonics Packaging and Integration II
26 January 2000 | San Jose, CA, United States
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