Dr. Hongyou Zhang Profile

Dr. Hongyou Zhang

at Focuslight Technologies Inc

SPIE Involvement:

Author

Publications (8)

SPIE Journal Paper | 9 March 2020

Method to control near-field bowing of laser diode arrays by balancing the thermal-induced stress

Hongyou Zhang, Chung-en Zah, Xingsheng Liu

OE, Vol. 59, Issue 03, 036104, (March 2020) https://doi.org/10.1117/12.10.1117/1.OE.59.3.036104

KEYWORDS: Near field, Semiconductor lasers, Laser bonding, Copper, Silicon carbide, Aluminum nitride, Laser welding, Optical engineering, Near field optics, Beam shaping

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Proceedings Article | 21 February 2020 Presentation + Paper

High power 250W CW conductively cooled diode laser arrays with low-smile

Hongyou Zhang, Pengfei Zhu, Tuanwei Fu, Meiqin Li, Ning Lv, Wenwei Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11261, 112610C (2020) https://doi.org/10.1117/12.2540399

KEYWORDS: Packaging, High power lasers, Semiconductor lasers, Continuous wave operation, Laser bonding, Resistance

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Proceedings Article | 19 November 2019 Paper

High-power low-smile vertically-stacked laser diode based on microchannel cooling

Hongyou Zhang, Lei Cai, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11182, 111820F (2019) https://doi.org/10.1117/12.2536518

KEYWORDS: High power lasers, Semiconductor lasers, Continuous wave operation, Diodes, Packaging, Laser applications, Glasses, Cladding

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Proceedings Article | 4 March 2019 Paper

Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays

Hongyou Zhang, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10900, 109000T (2019) https://doi.org/10.1117/12.2506212

KEYWORDS: Packaging, Semiconductor lasers, High power lasers, Diodes, Laser bonding, Near field

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Proceedings Article | 5 November 2018 Paper

Quasi-CW performance and reliability of dual laser bars on a micro-channel cooler

Hongyou Zhang, Li Chen, Sen Zhao, Boxue Wang, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10811, 108110F (2018) https://doi.org/10.1117/12.2327073

KEYWORDS: Laser bonding, Packaging, Semiconductor lasers, Reliability, High power lasers, Solid state lasers, Laser welding, Diodes, Indium, Optical simulations

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SPIE Journal Paper | 24 March 2018

Method to improve near-field nonlinearity of a high-power diode laser array on a microchannel cooler

Hongyou Zhang, Yangtao Jia, Wanshao Cai, Chunhua Tao, Chung-en Zah, Xingsheng Liu

OE, Vol. 57, Issue 03, 036115, (March 2018) https://doi.org/10.1117/12.10.1117/1.OE.57.3.036115

KEYWORDS: Near field, Laser bonding, Packaging, Semiconductor lasers, Copper, Optical simulations, High power lasers, Diodes, Near field optics, Optical engineering

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Proceedings Article | 20 February 2018 Paper

Study on the near-field non-linearity (SMILE) of high power diode laser arrays

Hongyou Zhang, Yangtao Jia, Changxuan Li, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10513, 105131R (2018) https://doi.org/10.1117/12.2287580

KEYWORDS: Laser bonding, Indium, Laser welding, Optical simulations, Near field, Packaging, Semiconductor lasers, High power diode lasers, Copper, Near field optics

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Proceedings Article | 22 February 2017 Paper

Optimization of micro channel heat sinks for high-power 9xx-nm laser diodes

Hongyou Zhang, Xuejie Liang, Wanshao Cai, Chungen Zah, Xingsheng Liu

Proceedings Volume 10098, 1009829 (2017) https://doi.org/10.1117/12.2256112

KEYWORDS: High power lasers, Semiconductor lasers, Packaging, Diodes, Optoelectronic devices, Indium, Copper, Near field, Laser bonding, Continuous wave operation, Gallium arsenide

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Showing 5 of 8 publications

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