In this study, the drop-melting elements B and Hf were added to the alloy material for TLP diffusion welding, and the solidification behavior of IC10 alloy joint was analyzed, and the growth mechanism of γ, γ' and related compounds in TLP connection was explored. The results shows that element B was distributed in the grain boundary of the ISZ region, which increases the binding force of the grain boundary and increases the strength of the grain boundary. As a melting element, Hf element affects the liquid phase line temperature of the middle layer and makes the co-crystal liquid phase have good fluidity. The content of Hf elements has a great influence on the widening stage of the liquid phase area, which increases the dissolution amount of the base material, increases the weld width, and increases the liquid phase metal of the weld, which increases the difficulty of isothermal solidification of the weld and increases the time. When the isothermal solidification is completed, the TLP joint tissue only achieves the local tissue composition homogeneity, and continues to extend the thermal insulation time, which is conducive to the further diffusion of the alloy elements.
The 6063 Aluminum alloy brazing joint was prepared with the Al-Si12 solder. The effect of brazing temperature on the microstructure and shear properties of the brazed seam was studied and the interface was analyzed. With the increase of welding temperature, the shear strength of 6063 aluminum alloy joints first increases and then decreases with the increase of brazing temperature. When the optimal brazing process is 605℃ for 15 min, the interface between Al-Si12 solder and aluminum alloy is good, and the shear strength is 126 MPa. The fracture form of the joint is brittle fracture. In order to ensure the bonding strength of 6063 aluminum alloy, the optimal welding temperature for brazing is 605℃.
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