Mr. Hyo Chun Kang Profile

Hyo Chun Kang

at SAMSUNG Electronics Co Ltd

SPIE Involvement:

Author

Publications (3)

Proceedings Article | 10 May 2005 Paper

Methodology and mechanism study on high aspect ratio (HAR) contact bottom image in scanning electron microscopy

H. Kang, J. Lim, J. Choi, T. Lee, B. Lee, S. Chin, D. Cho

Proceedings Volume 5752, (2005) https://doi.org/10.1117/12.596832

KEYWORDS: Semiconducting wafers, Scanning electron microscopy, Image quality, Sensors, Critical dimension metrology, Electron microscopes, Electron transport, Image analysis, Control systems, Electronics

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Proceedings Article | 10 May 2005 Paper

Experimental study of contact edge roughness on sub-100 nm various circular shapes

Tae Lee, Dongchul Ihm, Hyo Kang, Jum Lee, Byoung Lee, Soo Chin, Do Cho, Chang Song

Proceedings Volume 5752, (2005) https://doi.org/10.1117/12.597948

KEYWORDS: Semiconducting wafers, Edge roughness, Critical dimension metrology, Line edge roughness, Distortion, Line width roughness, Metrology, Semiconductors, Image analysis, Image filtering

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Proceedings Article | 24 May 2004 Paper

Experimental methodology of contact edge roughness on sub-100-nm pattern

Tae Yong Lee, Dongchul Ihm, Hyo Chun Kang, Jun Bum Lee, Byoung-Ho Lee, Soo-Bok Chin, Do-Hyun Cho, Yang Hyong Kim, Ho Dong Yang, Kyoung Mo Yang

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.534496

KEYWORDS: Semiconducting wafers, Edge roughness, Line width roughness, Line edge roughness, Semiconductors, Critical dimension metrology, Distortion, Metrology, Optical lithography, Holmium

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