In this paper, we consider a method for constructing MEMS structures using a self-assembly operation based on controlled self-organization of mechanically stressed semiconductor layers. This work describes the design of highly sensitive tunneling linear acceleration sensors, as well as a nanoelectromechanical switch with two tunnel contacts. Accelerometers of this type have important advantages: hypersensitivity due to the tunnel effect, small dimensions compared to capacitive accelerometers, design flexibility due to wide construction variations depending on requirements, potential possibility of manufacturing structures with three axes of sensitivity in a single technological production cycle, high manufacturability. Tunneling nanoelectromechanical switches also have several advantages: such as low leakage current, energy efficiency, stability, good dynamic characteristics, and can be used in ultra-low-power electronics.
Reducing the complexity of the architecture of radio-frequency systems and subsystems of 5G mobile networks and Internet of Things currently requires the presence of passive RF components with very high performance. Considering these requirements, the technology of radio-frequency microelectromechanical systems for the development of passive RF devices allows us to solve the corresponding tasks related to the requirements of 5G and Internet of Things, concerning passive components and building blocks. Packaging of radio-frequency microelectromechanical systems and other passive components is a delicate issue, especially in line with future application contexts such as 5G and the Internet of Things, in which operating frequencies are approaching millimeter waves. In fact, when working with radio-frequency signals, the package, in addition to protecting encapsulated devices, should also have as limited an impact on their electromagnetic characteristics and performance as possible. Therefore, the packaging design stage must be carried out with extreme care. In this study, the verification of the methodology for electromagnetic modeling of a packaging solution at the wafer-level using through silicon vias for redistributing an electrical signal from passive radio-frequency microelectromechanical devices in package to other radio-frequency devices is discussed using the example of the developed capacitive radio-frequency microelectromechanical switch with double-clamp.
This paper is devoted to the selection of the optimal material for the structural layer of microelectromechanical switches in order to reduce or completely eliminate the stiction of the moving parts of the structure to the fixed, as well as to minimize the values of the control voltages and switching speed without compromising reliability using the Ashby approach. The choice of the most suitable structural layer material is represented by performance indices for a number of key parameters of microelectromechanical switches. It is established that aluminum-based alloys and metals are the most preferable than other available materials for the structural layer of microelectromechanical switches.
In the report the linear acceleration sensor design with three axis of sensitivity is researched. Parameterized geometry and finite element model for modal analysis are developed in the ANSYS program. Behavioral description of the study design is developed with language VHDL-AMS to simulate the sensor operation under the influence of linear acceleration along three axis of sensitivity. On the basis of research results three-axis device sensitivity, cross-sensitivity, duration transients are specified. As part of the work the experimental sensor prototypes are fabricated.
KEYWORDS: Signal processing, Transducers, Signal generators, Amplifiers, Interference (communication), Analog electronics, Gyroscopes, Device simulation, Electronics, Digital electronics
A method of signal processing devices design for micromechanical accelerometers with capacitive transducers is proposed. This method provides the complex solution of the sensibility increasing and noise immunity problems by finding of the difference frequency of signals, which are formed by two identical generators with micromechanical capacitive transducers in frequency control circuits. In this study the analog and digital versions of the highly sensitive signal processing devices circuits with frequency output were developed. The breadboards of these devices are fabricated and studied and the project of their integral realization is designed.
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