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Jack M. Kleinfeld
President & Consulting Engineer at Kleinfeld Technical Services Inc
SPIE Involvement:
Author | Instructor
Publications (4)
Proceedings Article | 18 May 2012 Paper
An evaluation of the impact of an example of thermal bridging in buildings and a design alternative
Proceedings Volume 8354, 83540J (2012) https://doi.org/10.1117/12.923877
KEYWORDS: Buildings, Bridges, Nose, Convection, Thermography, Infrared imaging, Heat flux, Infrared cameras, Temperature metrology, Infrared signatures
Proceedings Article | 28 March 2005 Paper
Going beyond detection: Can IR be used to quantify the amount and location of subsurface water?
Proceedings Volume 5782, (2005) https://doi.org/10.1117/12.609734
KEYWORDS: Thermography, Finite element methods, Infrared signatures, Temperature metrology, Thermal modeling, Infrared detectors, Thermal effects, Infrared imaging, Solids, Water
Proceedings Article | 19 March 1999 Paper
Examination of a carton sealing line using a thermographic scanner
Proceedings Volume 3700, (1999) https://doi.org/10.1117/12.342290
KEYWORDS: Temperature metrology, Scanners, Cameras, Polymers, Coating, Process control, Infrared imaging, Lithium, Process engineering, Liquids
Proceedings Article | 19 March 1999 Paper
Finite element analysis as a tool for thermography
Proceedings Volume 3700, (1999) https://doi.org/10.1117/12.342274
KEYWORDS: Finite element methods, Thermography, Convection, Glasses, Thermal modeling, Chemical elements, Complex systems, Structural analysis, Particles, Body temperature
Conference Committee Involvement (5)
Thermosense XXIX
10 April 2007 | Orlando, Florida, United States
Thermosense XXVIII
17 April 2006 | Orlando (Kissimmee), Florida, United States
Thermosense XXVII
29 March 2005 | Orlando, Florida, United States
Thermosense XXVI
13 April 2004 | Orlando, Florida, United States
Thermosense XXV
22 April 2003 | Orlando, Florida, United States
Course Instructor
SC543: FEA for Heat Transfer Analysis in Thermography and Hardware Design
The course will present the use of finite element analysis (FEA) to perform heat transfer analysis. FEA is a numerical solution method with wide applicability. It allows solutions to problems that are difficult or impossible to solve explicitly. It is readily performed using commercially available software. Stress will be placed on the use of heat transfer analysis to improve the effectiveness, efficiency, and application of infrared thermography. Application to product troubleshooting, improvement, design and testing will also be illustrated. This will not be a software training course.
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