Exfoliated gallium oxide (Ga2O3) has been reported as an ultrathin channel material in field-effect transistors. Unlike in 2D materials with van der Waals forces between stacked layers, weak bonding in β-Ga2O3 along the (100) direction enables mechanical exfoliation. The thickness of these exfoliated films has been limited to tens to hundreds of nanometers. Here we summarize our latest work, which followed the process developed by Carey et al., enabling us to attain ~2 nm thick Ga2O3 films over a large surface area (< 1 mm2). The films are characterized using optical microscopy, AFM, XPS, Raman spectroscopy, photoluminescence (PL), and TEM. Optical microscope images showed color changes to the film upon annealing. AFM revealed the film thickness to be as thin as 2 nm over areas << 1 mm2. XPS and Raman spectra revealed characteristic signatures of β-phase Ga2O3. Characteristic PL of Ga2O3 was seen in all samples with overall intensity of luminescence increasing after annealing, attributed to increased crystallinity and grain size. Changes in PL after annealing are associated with an increase in oxygen interstitials and a decrease in oxygen vacancies. Lastly, TEM analysis revealed the film as β-phase Ga2O3 polycrystalline. Overall, our results demonstrate that annealing of thin films obtained from oxide printing of liquid metal Ga is a non-expensive and straightforward process that can lead to β-Ga2O3 films that are nanometer-thin over wafer-scale areas.
In this work, we experimentally demonstrate a 3D printed compact THz spectral splitter based on a single planar broadband diffractive optical element, designed to disperse an incident collimated THz beam (0.5 THz to 0.7 THz) designed with the help of an inverse design technique namely gradient descent assisted binary search algorithm. Aside from the current challenges associated with 3D printing and better measurement facilities, preliminary experimental demonstration highlights the fact that these computationally optimized free space devices could be a significant step towards enabling new types of compact THz spectral splitters or even splitters operating beyond the THz regime.
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