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Jau-Yu Tsai
at United Microelectronics Corp
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Publications (1)
Proceedings Article | 6 April 2012 Paper
Apply low-temperature plasma in the rework procedure of Al film structure to prevent pattern collapsed and CuAl[sub]2[/sub] precipitation
Jau Yu Tsai, Kung Hsun Tsao, Tsz Yuan Chen, Chih Chung Huang, Huan Hsin Yeh, Yu Huan Liu
Proceedings Volume 8324, 83243B (2012) https://doi.org/10.1117/12.917888
KEYWORDS: Plasma, Aluminum, Photoresist processing, Etching, Semiconducting wafers, Wet etching, Bridges, Metals, Copper, Lithography
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