Jeremy A. Walraven
Senior Member Technical Staff at Sandia National Labs
SPIE Involvement:
Author
Publications (11)

Proceedings Article | 5 February 2010 Paper
Proc. SPIE. 7592, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
KEYWORDS: Microelectromechanical systems, Contamination, Resonators, Sensors, Electrodes, Silicon, Aluminum, Aluminum nitride, Semiconducting wafers, Network security

Proceedings Article | 22 January 2005 Paper
Proc. SPIE. 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
KEYWORDS: Target detection, Microelectromechanical systems, Actuators, Oxides, Thermography, Laser induced damage, Silicon, Optical fabrication, Laser irradiation, Failure analysis

Proceedings Article | 22 January 2005 Paper
Proc. SPIE. 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
KEYWORDS: Microelectromechanical systems, Packaging, Polishing, Switches, Ceramics, Silicon, Inspection, Epoxies, Failure analysis, Electrical breakdown

Proceedings Article | 23 December 2003 Paper
Proc. SPIE. 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III
KEYWORDS: Microelectromechanical systems, Actuators, Data modeling, Modulation, Silicon, Reliability, Resistance, Scanning electron microscopy, Photomicroscopy, Thermal modeling

Proceedings Article | 16 January 2003 Paper
Proc. SPIE. 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II
KEYWORDS: Microelectromechanical systems, Actuators, Oxides, Silicon, Reliability, Optical alignment, Microfabrication, Computer aided design, Tolerancing, Failure analysis

Showing 5 of 11 publications
Conference Committee Involvement (4)
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V
25 January 2006 | San Jose, California, United States
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV
25 January 2005 | San Jose, California, United States
Reliability, Testing, and Characterization of MEMS/MOEMS III
26 January 2004 | San Jose, California, United States
Reliability, Testing, and Characterization of MEMS/MOEMS II
27 January 2003 | San Jose, CA, United States
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