Dr. Jian Mi Profile

Dr. Jian Mi

Senior Director of Applications at Four Dimensions Inc

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Author

Publications (4)

Proceedings Article | 20 March 2020 Presentation + Paper

3D-NAND wafer process monitoring using high voltage SEM with auto e-beam tilt technology

Leeming Tu, Jian Mi, Henry Fan, Haydn Zhou, Felix Xiong, Louis Tu, Gangyi Chen, Chuanyu Shao, Long Zhang, Shinji Kubo

Proceedings Volume 11325, 113250L (2020) https://doi.org/10.1117/12.2551610

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Overlay metrology, Sensors, Signal detection, 3D metrology, Etching, Electron beams, Electron microscopes

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Proceedings Article | 20 March 2020 Presentation + Paper

Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production

Michael Meng, Leeming Tu, Jian Mi, Haydn Zhou, Xi Zou

Proceedings Volume 11325, 113250O (2020) https://doi.org/10.1117/12.2551622

KEYWORDS: Semiconducting wafers, Machine learning, Wafer-level optics, 3D metrology, Metrology, Channel projecting optics, Optical metrology, Principal component analysis, Scanning electron microscopy, Etching

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Proceedings Article | 20 March 2019 Paper

Novel pattern-centric solution for high performance 3D NAND VIA dishing metrology

Sicong Wang, Jian Mi, Abhishek Vikram, Gao Xu, Guojie Cheng, Liming Zhang, Pan Liu

Proceedings Volume 10962, 1096217 (2019) https://doi.org/10.1117/12.2524569

KEYWORDS: Metrology, Semiconducting wafers, Image processing, Metals, 3D metrology, Atomic force microscopy, Chemical mechanical planarization, 3D image processing, Wafer bonding, Data processing

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Proceedings Article | 13 March 2018 Paper

A new way of measuring wiggling pattern in SADP for 3D NAND technology

Jian Mi, Ziqi Chen, Li Ming Tu, Xiaoming Mao, Gong Cai Liu, Hiroki Kawada

Proceedings Volume 10585, 105852S (2018) https://doi.org/10.1117/12.2297249

KEYWORDS: Double patterning technology, Metrology, Optical inspection, Scanning electron microscopy, Image compression, Visualization, Inspection, Semiconducting wafers, Image visualization, Image enhancement

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