Proceedings Article | 8 February 2008
John Lau, Ying Ying Lim, Teck Guan Lim, Gong Yue Tang, Chee Houe Khong, Xiaowu Zhang, Pamidighantam Ramana, Jing Zhang, Chee Wei Tan, Jayakrishnan Chandrappan, Joey Chai, Jing Li, Geri Tangdiongga, Dim Lee Kwong
Proc. SPIE. 6899, Photonics Packaging, Integration, and Interconnects VIII
KEYWORDS: Waveguides, Signal attenuation, Polymers, Copper, Optoelectronics, Optoelectronic devices, Vertical cavity surface emitting lasers, Multiplexers, Optical printed circuit boards, Polymer multimode waveguides
In this study, a low-cost (with bare chips) and high (optical, electrical, and thermal) performance optoelectronic system with
a data rate of 10Gbps is designed and analyzed. This system consists of a rigid printed circuit board (PCB) made of FR4
material with an optical polymer waveguide, a vertical cavity surface emitted laser (VCSEL), a driver chip, a 16:1 serializer,
a photo-diode detector, a Trans-Impedance Amplifier (TIA), a 1:16 deserializer, and heat spreaders. The bare VCSEL, driver
chip, and serializer chip are stacked with wire bonds and then solder jointed on one end of the optical polymer waveguide on
the PCB via Cu posts. Similarly, the bare photo-diode detector, TIA chip, and deserializer chip are stacked with wire bonds
and then solder jointed on the other end of the waveguide on the PCB via Cu posts. Because the devices in the 3D stacking
system are made with different materials, the stresses due to the thermal expansion mismatch among various parts of the
system are determined.
