Dr. Jingwei Wang Profile

Dr. Jingwei Wang

at Focuslight Technologies Inc

SPIE Involvement:

Author

Publications (25)

Proceedings Article | 27 November 2023 Paper

High Power conduction cooled annular diode laser stack packaged by gold-tin hard solder

Jingwei Wang, Yanfang Zheng, Yang Han, Tuanwei Fu, Dong Hou, Xingsheng Liu

Proceedings Volume 12761, 127610N (2023) https://doi.org/10.1117/12.2687224

KEYWORDS: Semiconductor lasers, High power lasers, Laser soldering, Laser bonding, Reliability, Design and modelling, Surgery, Solid state lasers, Scientific research, Packaging

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Proceedings Article | 4 March 2022 Poster + Presentation + Paper

Development of diode laser stack with high power and long pulse width for medical aesthetic application

Junli Li, Tuanwei Fu, Dong Hou, Jingwei Wang, Yunzhu Chen, Yanfang Zheng, Chungen Zah, Xingsheng Liu

Proceedings Volume 11983, 119830R (2022) https://doi.org/10.1117/12.2608522

KEYWORDS: Semiconductor lasers, Resistance, Convection, Reliability, Laser development, Thermal modeling, Pulsed laser operation, Laser bonding, High power lasers

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Proceedings Article | 9 October 2021 Paper

Structural optimization of reducing the thermal stress and Smile in packaging a high-power diode laser array on a microchannel cooler using gold-tin hard solder

Jingwei Wang, Tuanwei Fu, Dong Hou, Lijun Gao, Chung-en Zah, Xingsheng Liu

Proceedings Volume 11891, 118910D (2021) https://doi.org/10.1117/12.2602338

KEYWORDS: Semiconductor lasers, Packaging, High power diode lasers, Near field, Continuous wave operation, Heatsinks

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Proceedings Article | 10 October 2020 Poster + Presentation + Paper

A high-performance annularly stacked laser diode pump for a solid state laser

Junli Li, Lichen Sun, Ming Liu, Yang Han, Tuanwei Fu, Lei Cai, Yanfang Zheng, Minna Yan, Juan Wang, Chunhua Tao, Lijun Gao, Jingwei Wang, Chungen Zah, Xingsheng Liu

Proceedings Volume 11545, 115450J (2020) https://doi.org/10.1117/12.2573534

KEYWORDS: Semiconductor lasers, Laser applications, Packaging, Laser development, Solid state lasers, Manufacturing, Laser systems engineering

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Proceedings Article | 10 October 2020 Presentation + Paper

Kilowatt line beam from a 905nm pulsed diode laser module for LiDAR applications

Jingwei Wang, Xuejie Liang, Lei Cai, Wenjie Fan

Proceedings Volume 11545, 1154502 (2020) https://doi.org/10.1117/12.2573403

KEYWORDS: LIDAR, Semiconductor lasers, Pulsed laser operation, Laser applications, Transmitters, Laser development, Light sources, Lenses, Tolerancing, Assembly tolerances

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Proceedings Article | 4 March 2019 Presentation + Paper

Development of high power annular diode laser array using hard solder

Dong Hou, Lichen Sun, Tuanwei Fu, Li Chen, Xuejie Liang, Lei Cai, Yan Yang, Jingwei Wang, Minna Yan, Chungen Zah, Xingsheng Liu

Proceedings Volume 10899, 108990A (2019) https://doi.org/10.1117/12.2510023

KEYWORDS: Semiconductor lasers, High power lasers, Packaging, Dielectrics, Optical simulations, Gallium arsenide, Copper, Laser development, Structural design, Optical isolators

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Proceedings Article | 20 February 2018 Paper

High power multiple wavelength diode laser stack for DPSSL application without temperature control

Dong Hou, Xia Yin, Jingwei Wang, Shi Chen, Yun Zhan, Xiaoning Li, Yingmin Fan, Xingsheng Liu

Proceedings Volume 10513, 1051311 (2018) https://doi.org/10.1117/12.2291169

KEYWORDS: Semiconductor lasers, Absorption, Solid state lasers, Temperature metrology, Nd:YAG lasers, Crystals, Resistance, High power lasers, Laser development, Heatsinks

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Proceedings Article | 20 February 2018 Presentation + Paper

Fully utilizing high power diode lasers by synergizing diode laser light sources and beam shaping micro-optics

Yingmin Fan, Jingwei Wang, Lei Cai, Thomas Mitra, Dirk Hauschild, Chung-En Zah, Xingsheng Liu

Proceedings Volume 10513, 105130H (2018) https://doi.org/10.1117/12.2293612

KEYWORDS: Semiconductor lasers, Beam shaping, Micro optics, Light sources, Laser applications, Collimation, Cladding, High power diode lasers, Laser processing, Annealing

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Proceedings Article | 22 February 2017 Presentation + Paper

Thermal characteristics of compact conduction-cooled high power diode laser array packages

Pu Zhang, Xingsheng Liu, Qiwen Zhu, Jingwei Wang

Proceedings Volume 10085, 100850A (2017) https://doi.org/10.1117/12.2250258

KEYWORDS: High power diode lasers, Packaging, Thermal effects, Thermal analysis, Semiconductor lasers, Ceramics, Finite element methods, Pulsed laser operation, Indium

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Proceedings Article | 22 February 2017 Presentation + Paper

Optimization of microchannel cooler of high power diode laser array package

Dihai Wu, Pu Zhang, Zhiqiang Nie, Xuejie Liang, Jingwei Wang, Xingsheng Liu

Proceedings Volume 10085, 100850I (2017) https://doi.org/10.1117/12.2255693

KEYWORDS: Copper, Microfluidics, Solids, Fluid dynamics

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Proceedings Article | 22 February 2017 Presentation + Paper

Complete indium-free CW 200W passively cooled high power diode laser array using double-side cooling technology

Jingwei Wang, Pengfei Zhu, Hui Liu, Xuejie Liang, Dihai Wu, Yalong Liu, Dongshan Yu, Chung-en Zah, Xingsheng Liu

Proceedings Volume 10085, 1008504 (2017) https://doi.org/10.1117/12.2253442

KEYWORDS: Chemical weapons, Copper, Heatsinks, Near field

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Proceedings Article | 20 February 2017 Paper

High power vertical stacked diode laser development using macro-channel water cooling and hard solder bonding technology

Dongshan Yu, Xuejie Liang, Jingwei Wang, Xiaoning Li, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 10123, 101231A (2017) https://doi.org/10.1117/12.2250692

KEYWORDS: Semiconductor lasers, Laser applications, Reliability, Packaging, Laser development, Indium, High power lasers, Laser bonding, Corrosion, Copper, Pulsed laser operation, High power diode lasers, Gold, Thermal efficiency

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Proceedings Article | 20 February 2017 Presentation + Paper

Power degradation and reliability study of high-power laser bars at quasi-CW operation

Haoyu Zhang, Yong Fan, Hui Liu, Jingwei Wang, Chungen Zah, Xingsheng Liu

Proceedings Volume 10123, 101231E (2017) https://doi.org/10.1117/12.2256074

KEYWORDS: Failure analysis, Reliability, Semiconductor lasers, High power lasers, Continuous wave operation, Packaging, Pulsed laser operation, Mirrors, Near field, Quasi continuous wave operation, Solid state lighting

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Proceedings Article | 22 April 2016 Paper

Packaging of hard solder 500W QCW diode laser array

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9730, 97300D (2016) https://doi.org/10.1117/12.2213977

KEYWORDS: Semiconductor lasers, Packaging, High power lasers, Reliability, Copper, Laser bonding, Near field, High power diode lasers, Laser systems engineering

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Proceedings Article | 22 April 2016 Paper

High power diode laser array development using completely indium free packaging technology with narrow spectrum

Dong Hou, Jingwei Wang, Lijun Gao, Xuejie Liang, Xiaoning Li, Xingsheng Liu

Proceedings Volume 9730, 973009 (2016) https://doi.org/10.1117/12.2213928

KEYWORDS: Semiconductor lasers, High power diode lasers, Laser development, Indium, Resistance, Reliability, High power lasers, Numerical simulations, Gold

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Proceedings Article | 20 February 2015 Paper

Effects of packaging on the performances of high brightness 9xx nm CW mini-bar diode lasers

Xiaoning Li, Jingwei Wang, Feifei Feng, Yalong Liu, Dongshan Yu, Pu Zhang, Xingsheng Liu

Proceedings Volume 9346, 93460C (2015) https://doi.org/10.1117/12.2080480

KEYWORDS: Semiconductor lasers, Indium, Packaging, Continuous wave operation, Polarization, Reliability, High power diode lasers, Heatsinks, Fiber lasers, Copper

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Proceedings Article | 20 February 2015 Paper

Effect of interface layer on the performance of high power diode laser arrays

Pu Zhang, Jingwei Wang, Lingling Xiong, Xiaoning Li, Dong Hou, Xingsheng Liu

Proceedings Volume 9346, 934607 (2015) https://doi.org/10.1117/12.2077029

KEYWORDS: High power diode lasers, Semiconductor lasers, Interfaces, Finite element methods, Packaging, Laser development, Numerical simulations, Thermal effects, Copper, Reliability

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Proceedings Article | 20 February 2015 Paper

Advances in bonding technology for high power diode laser bars

Jingwei Wang, Xiaoning Li, Dong Hou, Feifei Feng, Yalong Liu, Xingsheng Liu

Proceedings Volume 9346, 934605 (2015) https://doi.org/10.1117/12.2079619

KEYWORDS: Semiconductor lasers, High power diode lasers, Indium, Liquids, Heatsinks, Reliability, Packaging, Laser bonding, Laser welding, Laser applications

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Proceedings Article | 20 February 2015 Paper

High power diode laser stack development using gold-tin bonding technology

Dong Hou, Jingwei Wang, Pu Zhang, Lei Cai, Ye Dai, Yingjie Li, Xingsheng Liu

Proceedings Volume 9346, 934604 (2015) https://doi.org/10.1117/12.2079610

KEYWORDS: Semiconductor lasers, Reliability, Laser development, Pulsed laser operation, Heatsinks, Indium, Packaging, High power diode lasers, High power lasers, Numerical simulations

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Proceedings Article | 3 February 2015 Paper

Packaging of complete indium-free high reliable and high power diode laser array

Jingwei Wang, Xiaoning Li, Feifei Feng, Yalong Liu, Dong Hou, Xingsheng Liu

Proceedings Volume 9255, 92550X (2015) https://doi.org/10.1117/12.2072357

KEYWORDS: Semiconductor lasers, High power diode lasers, Packaging, Indium, Copper, Heatsinks, Reliability, Laser bonding, Optical simulations, Laser development

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Proceedings Article | 3 February 2015 Paper

A 3000W 808nm QCW G-stack semiconductor laser array

Pu Zhang, Jingwei Wang, Dong Hou, Zhenfu Wang, Lingling Xiong, Hui Liu, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9255, 92550W (2015) https://doi.org/10.1117/12.2065663

KEYWORDS: Semiconductor lasers, Heatsinks, High power lasers, Finite element methods, Reliability, Copper, Laser development, Optical simulations, Indium, Laser welding

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Proceedings Article | 9 February 2012 Paper

High-power semiconductor laser array packaged on microchannel cooler using gold-tin soldering technology

Jingwei Wang, Lijun Kang, Pu Zhang, Zhiqiang Nie, Xiaoning Li, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410H (2012) https://doi.org/10.1117/12.909655

KEYWORDS: Semiconductor lasers, High power lasers, Laser welding, Packaging, Indium, Laser applications, Resistance, High power diode lasers, Continuous wave operation, Reliability

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Proceedings Article | 9 February 2012 Paper

Hard solder 20-kW QCW stack array diode laser

Xiaoning Li, Lijun Kang, Jingwei Wang, Pu Zhang, Lingling Xiong, Xingsheng Liu

Proceedings Volume 8241, 82410C (2012) https://doi.org/10.1117/12.909772

KEYWORDS: Semiconductor lasers, High power lasers, Beam controllers, Reliability, Packaging, Beam shaping, Collimation, Copper, Thermal effects, Laser welding

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Proceedings Article | 11 January 2007 Paper

Analysis of the output impulse of PCSS triggered by femto-second laser pulse

Zheng Jing, Tao Wang, Chi Ruan, Jingwei Wang, Hongchun Yang, Xiaoting Li, Leixue Wu

Proceedings Volume 6279, 62793T (2007) https://doi.org/10.1117/12.725331

KEYWORDS: Gallium arsenide, Pulsed laser operation, Semiconductors, Switches, Laser energy, Semiconductor lasers, Semiconductor materials, Control systems, Terahertz radiation, Metals

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Proceedings Article | 14 February 2006 Paper

Growth and characterization of GaxIn1-xAs1-ySby epitaxial layers grown by LP-MOCVD

Jingwei Wang, Yiding Wang, Tao Wang, Shuren Yang, Xiaoting Li, Jingzhi Yin, Xiaofeng Sai, Hongkai Gao

Proceedings Volume 6029, 602912 (2006) https://doi.org/10.1117/12.667720

KEYWORDS: Gallium antimonide, Antimony, Gallium indium arsenide antimonide phosphide, Scanning electron microscopy, Gallium, Chemical species, Gallium arsenide, X-ray diffraction, Crystals, Atomic force microscopy

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Showing 5 of 25 publications

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