Several stitching approaches are considered to secure patterning performance across the stitch boundary and at ASML Brion we are developing solutions to support patterning at resolution across the stitch. Sensitivity analysis is performed to quantify contrast, CD control, and pattern placement performance across the stitch boundary for holes and line/space layers and experimental CD control and experimental process capability and reticle patterning performance is presented and compared to the latest simulation and modelling capability using calibrated 0.33NA models and exposures. Especially important is to quantify cross talk of model accuracy errors, reticle CD errors, and placement errors in the stitching region where advanced models, scanner control and process design strategies are required.
As the industry is developing curvilinear mask solutions, some curvilinear postoptical proximity correction (OPC) masks have been reported with file sizes in excess of 10 times the corresponding Manhattan postOPC files, which can greatly impact mask data storage, transfer, and processing. Some file size reduction utilizing spline fittings has been reported in mask postprocessing. However, from an OPC perspective, mask postprocessing is undesirable. In this study, we show that maintaining an adequate density of mask control points (MCPs) is key to achieving the desired on-wafer lithographic performance, regardless of whether the MCPs are connected by spline sections or piecewise-linear segments. Our results suggest that spline-based MULTIGON records (defined by the Curvilinear Working Group convened in 2019) may not offer clear lithographic performance or file size benefits. We will also offer some guidance for controlling piecewise-linear file size without compromising lithographic performance.
As the industry is developing curvilinear mask solutions, some curvilinear post-OPC masks have been reported with file sizes in excess of 10 times the corresponding Manhattan post-OPC files, which can greatly impact mask data storage, transfer and processing. Some file size reduction utilizing spline fittings has been reported in mask post-processing. However, from an OPC perspective, mask post-processing is undesirable. In this study, we show that maintaining an adequate density of mask control points (MCPs) is key to achieving the desired on-wafer lithographic performance, regardless of whether the MCPs are connected by spline sections or piecewise-linear segments. Our results suggest that) may not offer clear lithographic performance or file size benefits. We will also offer some guidance for controlling piecewise-linear file size without compromising lithographic performance.
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