Dr. John H. Lau
at Institute of Microelectronics
SPIE Involvement:
Author
Publications (11)

Proceedings Article | 20 February 2008 Paper
Proc. SPIE. 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII
KEYWORDS: Silver, Indium, Interfaces, Wafer bonding, Diffusion, Gold, Solids, Semiconducting wafers, Metals, Packaging

Proceedings Article | 8 February 2008 Paper
Proc. SPIE. 6899, Photonics Packaging, Integration, and Interconnects VIII
KEYWORDS: Tunable lasers, Microelectromechanical systems, Silicon, Semiconductor lasers, Modulators, Mirrors, Dense wavelength division multiplexing, Wafer-level optics, Actuators, Optical design

Proceedings Article | 8 February 2008 Paper
Proc. SPIE. 6899, Photonics Packaging, Integration, and Interconnects VIII
KEYWORDS: Mirrors, Channel projecting optics, Lenses, Optical components, Coarse wavelength division multiplexing, Thin films, Optical filters, Assembly tolerances, Sensors, Optical design

Proceedings Article | 8 February 2008 Paper
Proc. SPIE. 6899, Photonics Packaging, Integration, and Interconnects VIII
KEYWORDS: Resistors, Silica, Metals, Silicon, Transmitters, Semiconductor lasers, Dielectrics, Eye, Signal attenuation, Coarse wavelength division multiplexing

Proceedings Article | 8 February 2008 Paper
Proc. SPIE. 6899, Photonics Packaging, Integration, and Interconnects VIII
KEYWORDS: Mirrors, Silicon, Single mode fibers, Optical components, Optical benches, Optics manufacturing, Optical alignment, Tolerancing, Semiconducting wafers, Optical fabrication

Showing 5 of 11 publications
Conference Committee Involvement (1)
Photonics Packaging, Integration, and Interconnects IX
26 January 2009 | San Jose, California, United States
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