Dr. John C. McNulty Profile

Dr. John C. McNulty

Principal Engineer at Exponent Inc

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Publications (3)

Proceedings Article | 18 February 2008 Open Access

A perspective on the reliability of MEMS-based components for telecommunications

John McNulty

Proceedings Volume 6884, 68840B (2008) https://doi.org/10.1117/12.773640

KEYWORDS: Microelectromechanical systems, Reliability, Tunable lasers, Tunable filters, Actuators, Semiconducting wafers, Telecommunications, Silicon, Packaging, Standards development

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Proceedings Article | 7 February 2007 Paper

Robust hard-solder packaging of conduction cooled laser diode bars

David Schleuning, Mike Griffin, Philip James, John McNulty, Dan Mendoza, John Morales, David Nabors, Mike Peters, Hailong Zhou, Murray Reed

Proceedings Volume 6456, 645604 (2007) https://doi.org/10.1117/12.701292

KEYWORDS: Packaging, Reliability, Finite element methods, Indium, Data modeling, Semiconductor lasers, Diodes, Thermal modeling, Temperature metrology

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Proceedings Article | 7 February 2007 Paper

Highly reliable hard soldered QCW laser diode stack packaging platform

Paul Rosenberg, Patrick Reichert, Jihua Du, Michael Fouksman, Hailong Zhou, John McNulty, Sherry Tolman, Calvin Luong

Proceedings Volume 6456, 645618 (2007) https://doi.org/10.1117/12.701303

KEYWORDS: Indium, Laser welding, Resistance, Semiconductor lasers, Reliability, Waveguides, Packaging, Diodes, Heatsinks, Thermography

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