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Dr. Jorge R. Parra Michel
at Universidad De La Salle Bajío
SPIE Involvement:
Author
Area of Expertise:
interferometry , strees analysis , moiré , ESPI , deformation measurement , holography
Websites:
Company Website
Publications (1)
Proceedings Article | 10 September 2009 Paper
Computation of crack tip elastic strain intensity factor in mode I by electronic speckle pattern interferometry
Proc. SPIE. 7432, Optical Inspection and Metrology for Non-Optics Industries
KEYWORDS: Mechanics, Speckle, Image processing, Manufacturing, Resistance, Interferometry, Phase shift keying, Speckle pattern, Finite element methods, Failure analysis
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