Dr. Juan Manuel Trujillo-Sevilla Profile

Dr. Juan Manuel Trujillo-Sevilla

at Wooptix SL

SPIE Involvement:

Author

Publications (28)

Proceedings Article | 10 April 2024 Poster + Paper

New optical metrology technique for measuring the shape of a lithography photo mask

Jan Gaudestad, Guillermo Castro Luis, Miguel Jiménez, Kiril Ivanov Kurtev, Juan Trujillo-Sevilla, Jose Manuel Ramos-Rodríguez

Proceedings Volume 12955, 129553L (2024) https://doi.org/10.1117/12.3011886

KEYWORDS: Photomasks, Reflection, Chromium, Pellicles, Quartz, Semiconducting wafers, Wavefronts, Lithography, Neodymium, Phase imaging

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Proceedings Article | 11 March 2024 Presentation + Paper

Repeatability study of silicon wafer shape measurements

Miguel Jiménez, Jan Gaudestad, Kiril Ivanov Kurtev, Rubén Abrante, Juan Trujillo-Sevilla, Jose Manuel Ramos-Rodríguez

Proceedings Volume 12893, 128930E (2024) https://doi.org/10.1117/12.2692506

KEYWORDS: Semiconducting wafers, Silicon, Cameras, Photovoltaics, Mirrors, Wavefronts, Reflection, Data acquisition, Calibration, Phase imaging

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Proceedings Article | 21 November 2023 Presentation + Paper

New technique for measuring free-form wafer shape to enable wafer distortion predictions

Jan Gaudestad, Kiril Ivanov Kurteva, Juan Trujillo-Sevilla, Leon van Dijk, Ronald Otten, Guillermo Castro Luis, Richard van Haren

Proceedings Volume 12750, 127500H (2023) https://doi.org/10.1117/12.2687605

KEYWORDS: Semiconducting wafers, Optical alignment, Silicon, Alignment modeling, Data acquisition, Coating stress, Wavefronts, Wafer-level optics, Scanners, Optical parametric oscillators

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On product overlay (OPO) is one of the most critical parameters for continued scaling according to Moore’s law. Besides the lithography scanner, also non-lithography processes contribute to the OPO performance. For example, processes like etching and thin film deposition can introduce stress, or stress changes, in the thin films on top of the silicon wafers. In general, the scanner Higher Order Wafer Alignment model up to 3rd order (HOWA3) has proven to be adequate to correct for most process-induced wafer distortions. This model is typically used with 28 wafer alignment marks placed across the wafer to correct for more global stress-induced distortions. It is evident that if the stress variation manifests itself on shorter length scales, either more alignment marks are needed in combination with a more sophisticated wafer alignment model, or an alternative measurement of the wafer distortion is required. A viable alternative to characterize local wafer deformations is by measuring the free-form wafer-shape change due to processing. In case the wafer-shape change can be translated into a wafer distortion map, it can be complementary to what is already captured by the scanner wafer alignment model. In this paper, we would like to explore this functionality that is based on a new method to measure the free-form wafer shape. Wave Front Phase Imaging (WFPI) generates the wafer shape by registering the intensity of the light reflected off the patterned or blank silicon wafer surface at two different locations along the optical path. The wafer is held vertically to allow for the free-form wafer shape to be measured without being affected by gravity. We show data acquired on specialty made silicon wafers using a WFPI lab tool that acquired 16.3 million data points on a 300mm wafer with 65μm spatial resolution. The obtained free-form wafer-shape measurements are fed into existing prediction models and the resulting wafer distortion maps are compared with scanner measurements.

Proceedings Article | 5 October 2023 Paper

New wave front phase sensor used for 3D shape measurements of patterned silicon wafers

Jan Gaudestad, Kiril Ivanov Kurtev, Guillermo Castro Luis, Juan Trujillo-Sevilla, Rubén Abranta, Miguel Jiméneza

Proceedings Volume 12802, 128020C (2023) https://doi.org/10.1117/12.2675624

KEYWORDS: Semiconducting wafers, Silicon, Data acquisition, Reflection, Wavefronts, Metals, Image sensors, Cameras, Wafer-level optics, Collimation

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On product overlay (OPO) is one of the most critical parameters for the continued scaling according to Moore’s law. Without good overlay between the mask and the silicon wafer inside the lithography tool, yield will suffer. As the OPO budget shrinks, non-lithography process induced stress causing in-plane distortions (IPD) becomes a more dominant contributor to the shrinking overlay budget. To estimate the process induced in-plane wafer distortion after cucking the wafer onto the scanner board, a high-resolution measurement of the freeform wafer shape of the unclamped wafer, with the gravity effect removed, is needed. A high-resolution wafer shape map using a feed-forward prediction algorithm, as has been published by ASML, can account for both intra and inter die wafer distortions, minimizing the need for alignment marks on the die and wafer in addition to that it can be performed at any lithography layer. Up until now, the semiconductor industry has been using Coherent Gradient Sensing (CGS) interferometry or Fizeau interferometry to generate the wave front phase from the reflecting wafer surface to measure the free form wafer shape. However, these techniques have only been available for 300mm wafers. In this paper we introduce Wave Front Phase Imaging (WFPI), a new technique that can measure the free form wafer shape of a patterned silicon wafer using only the intensity of the reflected light. In the WFPI system, the wafer is held vertically to avoid the effects of gravity during measurements. The wave front phase is then measured by acquiring only the 2-dimensional intensity distribution of the reflected non-coherent light at two or more distances along the optical path using a standard, low noise, CMOS sensor. This method allows for very high data acquisition speed, equal to the camera’s shutter time, and a high number of data points with the same number of pixels as available in the digital imaging sensor. In the measurements presented in this paper, we acquired 7.3 million data points on a full 200mm patterned silicon wafer with a lateral resolution of 65μm. The same system presented can also acquire data on a 300mm silicon wafer in which case 16.3 million data points with the same 65μm spatial resolution were collected.

Proceedings Article | 28 September 2023 Presentation + Paper

New patterned silicon wafer shape metrology system

Jan Gaudestad, Juan Trujillo-Sevilla, José Manuel Ramos-Rodríguez, Rubén Abrante, Miguel Jiméneza, Kiril Ivanov Kurtev, Guillermo Castro Luis

Proceedings Volume 12665, 126650A (2023) https://doi.org/10.1117/12.2678349

KEYWORDS: Semiconducting wafers, Silicon, Data acquisition, Reflection, Wavefronts, Image sensors, Cameras, Wafer-level optics, Photovoltaics, Metrology

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On-product overlay (OPO), with its continually shrinking overlay budget, remains a constraint in the continued effort at increasing device yield. Overlay metrology capability currently lags the need for improved overlay control, especially for multi-patterning applications. The free form shape of the silicon wafer is critical for process monitoring and is usually controlled through bow and warp measurements during the process flow. As the OPO budget shrinks, non-lithography process induced stress causing in plane distortions (IPD) becomes a more dominant contributor to the shrinking overlay budget. To estimate the wafer process induced IPD parameters after cucking the wafer inside the lithographic scanner, a high-resolution measurement of the freeform wafer shape of the unclamped wafer is needed. The free form wafer shape can then be used in a feed-forward prediction algorithm to predict both intra field and intra die distortions, as has been published by ASML, to minimize the need for alignment marks on the die and wafer and allows for overlay to be performed at any lithography layer. Up until now, the semiconductor industry has been using Coherent Gradient Sensing (CGS) interferometry or Fizeau interferometry to generate the wave front phase from the reflecting wafer surface. The wave front phase is then used to calculate the slope which again generates a shape map of the silicon wafer. However, these techniques have only been available for 300mm wafers. In this paper we introduce Wave Front Phase Imaging (WFPI), a new technique that can measure the free form wafer shape of a patterned silicon wafer using only the intensity of the reflected light. In the WFPI system, the wafer is held vertically to avoid the effects of gravity during measurements. The wave front phase is then measured by acquiring only the 2- dimensional intensity distribution of the reflected non-coherent light at two or more distances along the optical path using a standard, low noise, CMOS sensor. This method allows for very high data acquisition speed, equal to the camera’s shutter time, and a high number of data points with the same number of pixels as available in the digital imaging sensor. In the measurements presented in this paper, we acquired 7.3 million data points on a full 200mm patterned silicon wafer with a lateral resolution of 65μm. The same system presented can also acquire data on a 300mm silicon wafer in which case 16.3 million data points with the same 65μm spatial resolution were collected.

Proceedings Article | 15 August 2023 Poster + Paper

New wafer shape measurement technique for 300mm blank vertically held silicon wafers

Rubén Abrante, Miguel Jiménez, Jan Gaudestad, Juan Trujillo-Sevilla, Kiril Ivanov Kurtev, Guillermo Castro Luis

Proceedings Volume 12618, 126182X (2023) https://doi.org/10.1117/12.2674201

KEYWORDS: Semiconducting wafers, Silicon, Wavefronts, Reflection, Cameras, Image sensors, Collimation, Photovoltaics, Data acquisition, Wafer testing

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Proceedings Article | 27 April 2023 Poster + Paper

New metrology technique for measuring the free shape of a patterned 300mm wafer held vertically

Jan Gaudestad, Juan Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Miguel Jesús Sicilia, Jose Manuel Ramos-Rodríguez

Proceedings Volume 12496, 124963G (2023) https://doi.org/10.1117/12.2661903

KEYWORDS: Semiconducting wafers, Silicon, Reflection, Wavefronts, Data acquisition, Cameras, Wafer-level optics, Image sensors, Phase imaging, Metrology

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Proceedings Article | 8 March 2023 Presentation + Paper

New wafer shape measurement technique for 300mm blank vertically held silicon wafer

Jan Gaudestad, Juan Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Javier González Pardo, Jose Manuel Ramos-Rodríguez

Proceedings Volume 12428, 124280U (2023) https://doi.org/10.1117/12.2651981

KEYWORDS: Semiconducting wafers, Silicon, Wavefronts, Reflection, Data acquisition, Collimation, Camera shutters, Overlay metrology, Gaussian filters, Cameras

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Proceedings Article | 7 December 2022 Poster + Paper

New wavefront phase sensor used for 3D shape measurements of silicon wafers

Jan Gaudestad, Juan Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Miguel Jesús Sicilia, Jose Manuel Ramos-Rodríguez

Proceedings Volume 12274, 122741F (2022) https://doi.org/10.1117/12.2645969

KEYWORDS: Semiconducting wafers, Silicon, Wavefronts, Cameras, Sensors, Reflectivity, 3D metrology, Wafer-level optics, Phase imaging, Image sensors

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Proceedings Article | 1 December 2022 Presentation + Paper

New wave front phase sensor used for 3D shape measurements of patterned silicon wafers

Jan Gaudestad, Juan Trujillo-Sevilla, Javier González Pardo, Óscar Casanova-González, José Manuel Ramos-Rodríguez, Alex Roqué-Velasco, Miguel Jesús Sicilia

Proceedings Volume 12292, 122920P (2022) https://doi.org/10.1117/12.2642287

KEYWORDS: Semiconducting wafers, Silicon, Wavefronts, Metals, Data acquisition, Image sensors, Reflectivity, Surface finishing, Interferometry, Beam splitters

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Proceedings Article | 3 October 2022 Presentation + Paper

Wave front phase imaging for silicon wafer metrology

Jan Gaudestad, Juan Trujillo-Sevilla, Óscar Casanova-González, Alex Roqué-Velasco, Miguel Jesús Sicilia, José Manuel Rodríguez-Ramos

Proceedings Volume 12216, 1221605 (2022) https://doi.org/10.1117/12.2632499

KEYWORDS: Semiconducting wafers, Silicon, Wavefronts, Cameras, Reflectivity, Phase imaging, Metrology, Image sensors, Data acquisition, Wafer-level optics

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Proceedings Article | 26 May 2022 Presentation + Paper

New metrology technique for measuring patterned wafer geometry on a full 300mm wafer

Tom Osterheld, Brian Brown, Benjamin Cherian, Jan Gaudestad, Juan Trujillo-Sevilla, José Manuel Rodríguez-Ramos

Proceedings Volume 12053, 1205303 (2022) https://doi.org/10.1117/12.2614320

KEYWORDS: Semiconducting wafers, Silicon, Gaussian filters, Wavefronts, Wafer-level optics, Metrology, Cameras, Overlay metrology, Imaging systems, Data acquisition

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Proceedings Article | 5 March 2022 Presentation + Paper

New high repeatability wafer geometry measurement technique for full 200mm and 300mm blank wafers

Álvaro Pérez-García, Jan Gaudestad, Juan Trujillo-Sevilla, Óscar Casanova-González, Miriam Velasco-Ocaña, Sabato Ceruso, Ricardo Oliva-García, Óscar Gómez-Cárdenes, Javier Martín-Hernández, Alex Roqué-Velasco, José Manuel Rodríguez-Ramos

Proceedings Volume 12008, 120080A (2022) https://doi.org/10.1117/12.2607315

KEYWORDS: Semiconducting wafers, Photovoltaics, Silicon, Cameras, Data acquisition, Gaussian filters, Wavefronts, Lithography, Imaging systems

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Proceedings Article | 28 October 2021 Presentation + Paper

Stria measurement using wave front phase imaging on a transparent plate

Oscar Casanova-González, Miriam Velasco-Ocaña, Sabato Ceruso, Ricardo Oliva-García, Óscar Gómez-Cárdenes, Javier Martín-Hernández, Alex Roqué-Velasco, Jan Gaudestad, Juan M. Trujillo-Sevilla, Alvaro Pérez-García, José Manuel Rodríguez-Ramos

Proceedings Volume 11889, 118891I (2021) https://doi.org/10.1117/12.2605328

KEYWORDS: Wavefronts, Glasses, Phase imaging, Spatial frequencies, Refractive index, Manufacturing, Visualization, Reflectivity, Optical sensors, Light wave propagation

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Proceedings Article | 12 October 2021 Poster + Presentation + Paper

New metrology technique for measuring wafer geometry on a full 300mm silicon wafer

Juan Trujillo-Sevilla, Jan Gaudestad, Óscar Casanova-González, Miriam Velasco-Ocaña, Álvaro Pérez-García, Alex Roqué-Velasco, Sabato Ceruso, Ricardo Oliva-García, Óscar Gómez-Cárdenes, Javier Martín-Hernández, Jose Manuel Ramos-Rodríguez

Proceedings Volume 11854, 118541B (2021) https://doi.org/10.1117/12.2605516

KEYWORDS: Semiconducting wafers, Silicon, Photovoltaics, Gaussian filters, Data acquisition, Wavefronts, Metrology, Cameras, Overlay metrology, Image sensors

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Proceedings Article | 20 March 2020 Paper

High speed roughness measurement on blank silicon wafers using wave front phase imaging

J. Gaudestad, J. M. Trujillo-Sevilla, J. M. Rodríguez-Ramos

Proceedings Volume 11325, 113252W (2020) https://doi.org/10.1117/12.2547406

KEYWORDS: Semiconducting wafers, Silicon, Wafer-level optics, Wavefronts, Signal to noise ratio, Image resolution, Image sensors, Cameras, Linear filtering, Robotics

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Proceedings Article | 2 March 2020 Presentation + Paper

Wave front phase imaging of wafer geometry using high pass filtering to reveal nanotopography

J. M. Trujillo-Sevilla, J. M. Ramos-Rodríguez, J. Gaudestad

Proceedings Volume 11287, 112870W (2020) https://doi.org/10.1117/12.2547405

KEYWORDS: Semiconducting wafers, Silicon, Wafer-level optics, Wavefronts, Image resolution, Image sensors, Signal to noise ratio, Cameras, Linear filtering, Manufacturing

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Proceedings Article | 19 February 2020 Paper

New high-resolution wave ophthalmic instrument for the characterizing ocular optics

Jan Gaudestad, Juan M. Trujillo-Sevilla, Oscar Casanova-González, David Carmona-Ballester, Miguel Sicilia-Cabrera, Sabato Ceruso, José M. Rodríguez-Ramos, Sergio Bonaque-González

Proceedings Volume 11218, 112181W (2020) https://doi.org/10.1117/12.2548595

KEYWORDS: Sensors, Eye, Wavefront sensors, Image resolution, Wavefronts, Error analysis, Ophthalmology, Distance measurement, Actuators, Diagnostics

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Proceedings Article | 14 May 2019 Paper

Calibration method applied to a tunable tensor display system

Ricardo Oliva-García, Jose Rodríguez-Ramos, Lara Díaz-García, Miguel Sicilia-Cabrera, David Carmona-Ballester, Juan Trujillo-Sevilla, Sergio Bonaque-González, Jose Marichal-Hernández, Viana Guadalupe-Suárez

Proceedings Volume 10997, 1099709 (2019) https://doi.org/10.1117/12.2518865

KEYWORDS: Calibration, LCDs, Computing systems, Lanthanum, Liquid crystals, Polarizers, Displays, Multilayers, Prototyping, Polarization

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Proceedings Article | 4 March 2019 Presentation + Paper

High-resolution wave front phase sensor for silicon wafer metrology

O. Casanova Gonzalez, S. Bonaque-González, J. M. Trujillo-Sevilla, J. M. Rodríguez Ramos, J. Gaudestad

Proceedings Volume 10925, 109250I (2019) https://doi.org/10.1117/12.2505764

KEYWORDS: Semiconducting wafers, Confocal microscopy, Wavefronts, Mirrors, Data acquisition, Silicon, Sensors, Metrology

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Proceedings Article | 16 May 2018 Presentation + Paper

Privacy-enabled displays

Juan Trujillo-Sevilla, Lara Díaz-García, Juan Fernández-Valdivia, David Carmona-Ballester, José Rodríguez-Ramos, Óscar Casanova-González, Óscar Gómez-Cárdenes, Daniel Walo, Ángela Hernández-Delgado

Proceedings Volume 10666, 1066609 (2018) https://doi.org/10.1117/12.2306029

KEYWORDS: Multilayers, Image filtering, Linear filtering, 3D displays, Lanthanum, Optical filters, Eye, Spatial frequencies, Quality measurement, Reconstruction algorithms

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SPIE Journal Paper | 23 January 2018

Analyzing the impact of the initialization for the nonnegative tensor factorization in tensor displays

David Carmona-Ballester, Juan Manuel Trujillo-Sevilla, Sergio Bonaque-González, Ángela Hernández-Delgado, José Manuel Rodríguez-Ramos

OE, Vol. 57, Issue 06, 061603, (January 2018) https://doi.org/10.1117/12.10.1117/1.OE.57.6.061603

KEYWORDS: 3D displays, LCDs, Lanthanum, Optical engineering, Reconstruction algorithms, Signal to noise ratio, Multiplexing, 3D image processing, Translucency, Display technology

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Proceedings Article | 10 May 2017 Presentation + Paper

Focus measurement in 3D focal stack using direct and inverse discrete radon transform

David Carmona-Ballester, José G. Marichal-Hernández, Óscar Gómez-Cárdenes, Juan Trujillo-Sevilla, José Rodríguez-Ramos

Proceedings Volume 10219, 102190R (2017) https://doi.org/10.1117/12.2261921

KEYWORDS: Radon transform, 3D image processing, 3D metrology, Integral imaging, Stereoscopy, Computational imaging, Cameras, Wavelet transforms, Wavelets, Radon, Image filtering, Eye, Image quality, Image restoration, Interference (communication)

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Proceedings Article | 22 May 2015 Paper

Lightfield super-resolution through turbulence

José Rodríguez-Ramos, Juan Trujillo-Sevilla, Luis Rodríguez-Ramos, Óscar Cárdenes, Juan Fernández-Valdivia, Bahram Javidi, José G. Marichal-Hernández

Proceedings Volume 9495, 94950Q (2015) https://doi.org/10.1117/12.2177295

KEYWORDS: Wavefronts, Deconvolution, Turbulence, Microlens, Super resolution, Optical resolution, Phase measurement, Point spread functions, Telescopes, Cameras

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Proceedings Article | 15 May 2014 Paper

Tomographic wavefront retrieval by combined use of geometric and plenoptic sensors

J. Rodríguez-Ramos, J. Trujillo-Sevilla, Juan Fernández-Valdivia, L. Rodríguez-Ramos, José Marichal-Hernández

Proceedings Volume 9141, 914129 (2014) https://doi.org/10.1117/12.2053150

KEYWORDS: Sensors, Wavefronts, Stars, Microlens, Tomography, Telescopes, Adaptive optics, Atmospheric turbulence, Microlens array, Atmospheric optics

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Proceedings Article | 15 May 2012 Paper

Atmospherical wavefront phases using the plenoptic sensor (real data)

J. P. Lüke, M. López, R. López, J. M. Rodríguez-Ramos, L. Rodríguez-Ramos, I. Montilla, J. G. Marichal-Hernández, B. Femenía, J. J. Fernández-Valdivia, M. Puga, J. Trujillo-Sevilla, F. Rosa

Proceedings Volume 8384, 83840D (2012) https://doi.org/10.1117/12.923662

KEYWORDS: Sensors, Wavefronts, Telescopes, Sodium, Wavefront sensors, Turbulence, Adaptive optics, Microlens, Atmospheric sensing, Cameras

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Proceedings Article | 20 May 2011 Paper

3D imaging and wavefront sensing with a plenoptic objective

J. P. Lüke, J. J. Fernández-Valdivia, J. Trujillo-Sevilla, L. F. Rodríguez-Ramos, M. López, J. G. Marichal-Hernández, J. M. Rodríguez-Ramos, J. C. Sanluis, F. Rosa, R. López, C. Dominguez-Conde, M. Puga, I. Montilla, B. Femenía

Proceedings Volume 8043, 80430R (2011) https://doi.org/10.1117/12.883813

KEYWORDS: Microlens, Cameras, Sensors, Wavefronts, Microlens array, Telescopes, Adaptive optics, Calibration, Field programmable gate arrays, Wavefront sensors

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Proceedings Article | 11 July 2008 Paper

Real-time phase slopes calculations by correlations using FPGAs

J. Rodríguez Ramos, F. Rosa, J. Trujillo Sevilla, L. Rodríguez Ramos, E. Boemo, M. Valido

Proceedings Volume 7015, 70153B (2008) https://doi.org/10.1117/12.789492

KEYWORDS: Field programmable gate arrays, Wavefronts, Wavefront sensors, Algorithm development, Sensors, Image processing, Adaptive optics, Image sensors, Multiplexers, Optical correlators

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Showing 5 of 28 publications

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