Mr. Kamil Gradkowski Profile

Kamil Gradkowski

at Tyndall National Institute

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 8 March 2024 Presentation + Paper

Silicon nitride photonic integrated circuits for optical coherence tomography

Rainer Hainberger, Paul Müllner, Moritz Eggeling, Alejandro Maese-Novo, Yevhenii Morozov, Stefan Nevlacsil, Pietro Cipriano, Desiree Rist, Martin Sagmeister, Jochen Kraft, Stefan Richter, Michael Kempe, Stefan Gloor, Marcus Duelk, Nanko Verwaal, Gunay Yurtsever, Mathias Berciano, Filippo Ferraro, Pol Van Dorpe, Anja Agneter, Quang Nguyen, Elisabet Rank, Wolfgang Drexler, Mareike Trappen, Matthias Blaicher, Michael Thiel, Sharon Butler, Kamil Gradkowski, Padraic Morrissey, Peter O'Brien, Marko Vlaskovic, Horst Zimmermann, Dana Seyringer

Proceedings Volume 12890, 1289006 (2024) https://doi.org/10.1117/12.2692816

KEYWORDS: Optical coherence tomography, Photonic integrated circuits, Polarization, Waveguides, Simulations, Silicon nitride, Photodiodes, Arrayed waveguide gratings

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SPIE Journal Paper | 5 January 2024 Open Access

Substrate integrated micro-thermoelectric coolers in glass substrate for next-generation photonic packages

Parnika Gupta, Amit Tanwar, Xiuyun He, Kamil Gradkowski, Kafil M. Razeeb, Padraic E. Morrissey, Peter O’Brien

JOM, Vol. 4, Issue 01, 011006, (January 2024) https://doi.org/10.1117/12.10.1117/1.JOM.4.1.011006

KEYWORDS: Glasses, Thermoelectric materials, Copper, Resistance, Electrical conductivity, Optical microsystems, Temperature metrology, Silicon, Fabrication, Packaging

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SPIE Journal Paper | 29 November 2023 Open Access

Micro-transfer printing of thick optical components using a tether-free UV-curable approach

Saif Wakeel, Padraic E. Morrisey, Muhammet Genc, Prasanna Ramaswamy, Robert Bernson, Kamil Gradkowski, Brian Corbett, Peter O’Brien

JOM, Vol. 4, Issue 01, 011003, (November 2023) https://doi.org/10.1117/12.10.1117/1.JOM.4.1.011003

KEYWORDS: Printing, Silicon, Lenses, Epoxies, Semiconducting wafers, Optical components, Coating thickness, Photonics, Wafer bonding, Surface roughness

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Proceedings Article | 22 February 2018 Paper

Packaging of silicon photonic devices: from prototypes to production

Padraic Morrissey, Kamil Gradkowski, Lee Carroll, Peter O'Brien

Proceedings Volume 10537, 105370L (2018) https://doi.org/10.1117/12.2292674

KEYWORDS: Packaging, Photonic integrated circuits, Silicon photonics, Fiber couplers, Tolerancing, Prototyping, Silicon, Standards development, Photonic devices, Manufacturing

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