Dr. Kangmin Hsia Profile

Dr. Kangmin Hsia

Senior Engineer at Intel Corp

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Publications (5)

Proceedings Article | 17 October 2008 Paper

Pattern placement correction due to bending in EUVL masks

Seh-Jin Park, Chandhok Manish, Marilyn Kamna, Chuan Hu, Guojing Zhang, Fabian Martinez, Nathan Wilcox, Kamgmin Hsia, Alan Stivers

Proceedings Volume 7122, 71222C (2008) https://doi.org/10.1117/12.801542

KEYWORDS: Extreme ultraviolet lithography, Photomasks, Metrology, Thin films, Personal protective equipment, Distortion, Image registration, Thin film deposition, Extreme ultraviolet, Reticles

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Proceedings Article | 20 May 2006 Paper

EUV mask process development and integration

Guojing Zhang, Pei-Yang Yan, Ted Liang, Yan Du, Peter Sanchez, Seh-jin Park, Eric Lanzendorf, Chang Ju Choi, Emily Shu, Alan Stivers, Jeff Farnsworth, Kangmin Hsia, Manish Chandhok, Michael Leeson, Gilroy Vandentop

Proceedings Volume 6283, 62830G (2006) https://doi.org/10.1117/12.681839

KEYWORDS: Photomasks, Extreme ultraviolet, Etching, Reflectivity, Defect inspection, Extreme ultraviolet lithography, Inspection, Ruthenium, Image processing, Optical lithography

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Proceedings Article | 6 December 2004 Paper

EUV mask pilot line at Intel Corporation

Alan Stivers, Pei-Yang Yan, Guojing Zhang, Ted Liang, Emily Shu, Edita Tejnil, Barry Lieberman, Rajesh Nagpal, Kangmin Hsia, Michael Penn, Fu-Chang Lo

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569176

KEYWORDS: Photomasks, Extreme ultraviolet, Inspection, Extreme ultraviolet lithography, Reflectivity, Metrology, Lithography, Optical lithography, Standards development, Mask making

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Proceedings Article | 19 July 2000 Paper

Reticle inspection system using DUV wavelength and new alogorithm platform for advanced reticle inspection for 0.13-um technology node

David Alles, Paul Terbeek, Shauh-Teh Juang, James Wiley, Kangmin Hsia

Proceedings Volume 4066, (2000) https://doi.org/10.1117/12.392087

KEYWORDS: Reticles, Inspection, Photomasks, Deep ultraviolet, Optical proximity correction, Computing systems, Databases, Imaging systems, Manufacturing, Double positive medium

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KLA-Tencor has developed a fourth-generation reticle inspection system, the KLA-Tencor 570, using DUV imaging to detect 100-nm defects on advanced OPC and PSM reticles for the 0.13 micron technology node production and 0.10 micron technology development. This system contains innovations in optics, electronics, mechanics, algorithms, and software. The DUV wavelength of the optical system improves the resolution and thus the minimum linewidth capability. A low- noise optical system generates high-quality images to improve productivity, facilitate defect classification, and reduce operator errors. The United Inspection Computer (UIC), a high-speed scalable computational engine, renders database data to create an image of the mask for die-to- database inspections. The UIC uses the new Ultra-Performance Algorithm, which provides high detection sensitivity at high speed for D:D and D:DB inspections. UPA can handle complex structures such as advanced OPC and phase shift mask. TI places no fundamental requirement on the size of OPC features. UPA classified defects automatically. The operator can select sensitivity settings independently for each defect type. Since UPA measures the CD of every feature on the reticle, it can also make total plate quality measurements for statistical process control of mask manufacturing. A new reticle handling system reduces overhead time and allows easy loading and unloading of the reticle. This system manipulates 6-inch and 230-mm reticles with and without pellicles. A flexible adapter design allows the system to mix different reticle sizes. A new data preparation system executes on a multi-processor computer with a 64-bit operating system to minimize data preparation time. This DPS architecture allows the operator to change various inspection parameters such as pixel size, alignment points, DNIR's and rotation without the need for re-prep, thereby improving productivity and flexibility. The KLA- Tencor 570 also allows optional remote Data Prep. Test results indicate that the KLA-Tencor 570 already meets its sensitivity specifications on a Verimask VT 690 in both die- to-die and die-to-database modes.

Proceedings Article | 1 September 1991 Paper

Theory of transient self-focusing

Kangmin Hsia, Cyrus Cantrell

Proceedings Volume 1497, (1991) https://doi.org/10.1117/12.46772

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