Dr. Katia M. Grenier Profile

Dr. Katia M. Grenier

at Institute for Engineering and Systems Sciences

SPIE Involvement:

Author

Proceedings Article | 4 September 2008 Paper

Micro-interconnection technology suitable for RF-NEMS varactors elaboration

Sébastien Pacchini, Monique Dilhan, Thibaut Ricart, Costel Cojocaru, Didier Pribat, David Dubuc, Katia Grenier

Proceedings Volume 7037, 703719 (2008) https://doi.org/10.1117/12.795031

KEYWORDS: Silica, Silicon, Microwave radiation, Metals, Dielectrics, Nanoelectromechanical systems, Reactive ion etching, Chemical vapor deposition, Annealing, Nickel

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Proceedings Article | 4 September 2008 Paper

Carbon nanotube based microwave varactor: modeling, simulation, and design

Thibault Ricart, Sébastien Pacchini, Costel Cojocaru, Didier Pribat, David Dubuc, Katia Grenier

Proceedings Volume 7037, 70370F (2008) https://doi.org/10.1117/12.794576

KEYWORDS: Microwave radiation, Capacitance, Electromechanical design, Carbon nanotubes, Nanoelectromechanical systems, Capacitors, Electrodes, Numerical modeling, Dielectrics, Algorithm development

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Proceedings Article | 17 May 2007 Paper

Germanium as an integrated resistor material in RF MEMS switches

K. Grenier, C. Bordas, S. Pinaud, L. Salvagnac, D. Dubuc

Proceedings Volume 6589, 65890X (2007) https://doi.org/10.1117/12.722039

KEYWORDS: Germanium, Microelectromechanical systems, Resistors, Etching, Capacitors, Switches, Silicon, Bridges, Gold, Dielectrics

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Proceedings Article | 15 May 2007 Paper

Temperature stress impact on power RF MEMS switches

Chloé Bordas, Katia Grenier, David Dubuc, Mathieu Paillard, Jean-Louis Cazaux, Robert Plana

Proceedings Volume 6589, 65890V (2007) https://doi.org/10.1117/12.722010

KEYWORDS: Switches, Microelectromechanical systems, Bridges, Temperature metrology, Electrodes, Silicon, Gold, Dielectrics, Telecommunications, Failure analysis

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Proceedings Article | 1 July 2005 Open Access

MEMS above IC technology applied to a compact RF module

K. Grenier, L. Mazenq, D. Dubuc, E. Ojefors, P. Lindberg, A. Rydberg, J. Berntgen, W.-J. Rabe, E. Sonmez, P. Abele, H. Schumacher, R. Plana

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.609383

KEYWORDS: Silicon, Transistors, Antennas, Semiconducting wafers, Etching, Deep reactive ion etching, Micromachining, Polymers, Photoresist materials, Dielectrics

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Proceedings Article | 1 July 2005 Paper

Efficient topology and design methodology for RF MEMS switches

B. Ducarouge, D. Dubuc, S. Melle, K. Grenier, L. Mazenq, L. Bary, R. Plana

Proceedings Volume 5836, (2005) https://doi.org/10.1117/12.609396

KEYWORDS: Switches, Microelectromechanical systems, Bridges, Electrodes, Silicon, Microwave radiation, Electromechanical design, Electromagnetism, Capacitance, Device simulation

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Proceedings Article | 16 August 2004 Paper

MEMS-based redundancy ring for low-noise millimeter-wave front-end

Patrick Pons, David Dubuc, Federic Flourens, Mohammad Saddaoui, Samuel Melle, Alex Tackacs, Junwu Tao, Herve Aubert, Ali Boukabache, T. Paillot, Pierre Blondy, Olivier Vendier, Katia Grenier, Robert Plana

Proceedings Volume 5455, (2004) https://doi.org/10.1117/12.548751

KEYWORDS: Microelectromechanical systems, Dielectrics, Switches, Reliability, Waveguides, Microsystems, Microwave radiation, Silicon, Bridges, Gold

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This paper reports on the investigation of the potentialities of the MEMS technologies to develop innovative microsystem for millimetre wave communication essentially for space applications. One main issue deals with the robustness and the reliability of the equipment as it may difficult to replace or to repair them when a satellite has been launched. One solution deals with the development of redundancy rings that are making the front end more robust. Usually, the architecture of such system involves waveguide or diode technologies, which present severe limitations in term of weight, volume and insertion loss. The concept considered in this paper is to replace some key elements of such system by MEMS based devices (Micromachined transmission lines, switches) in order to optimize both the weight and the microwave performance of the module. A specific technological process has been developed consisting in the fabrication of the devices on a dielectric membrane on air suspended in order to improve the insertion loss and the isolation. To prove the concept, building blocks have been already fabricated and measured (i.e micromachined transmission and filter featuring very low insertion loss, single pole double through circuits to address the appropriate path of the redundancy ring). We have to outline that MEMS technology have allowed a simplification of the architecture and a different system partitioning which gives more degree of freedom for the system designer. Furthermore, it has been conducted an exhaustive reliability study in order to identify the failure mechanisms. Again, from the results obtained, we have proposed an original topology for the SPDT circuit that takes into account the reliability behaviour of the MEMS devices and that allow to prevent most of the failure mechanisms reported so far (mainly related to the dielectric charging effect). Finally, the active device (millimetre wave low noise amplifier) will be reported on the MEMS based chip using flip chip technology to integrate the Microsystem.

Proceedings Article | 24 April 2003 Paper

Polymers in RF and millimeter-wave applications

Katia Grenier, Victor Lubecke, Fouad Bouchriha, Laurent Rabbia, David Dubuc, Patrick Pons, Robert Plana

Proceedings Volume 5116, (2003) https://doi.org/10.1117/12.499052

KEYWORDS: Polymers, Silicon, Dielectrics, Signal attenuation, Micromachining, Etching, Oxides, Microelectromechanical systems, Semiconducting wafers, Microwave radiation

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Proceedings Article | 30 April 2001 Paper

Silicon MEM technology for millimeter-wave applications

Katia Grenier, D. Dubuc, Patrick Pons, Robert Plana, L. Rabbia, T. Parra, Jacques Graffeuil

Proceedings Volume 4407, (2001) https://doi.org/10.1117/12.425307

KEYWORDS: Bridges, Microelectromechanical systems, Switches, Silicon, Photoresist materials, Molecular bridges, Micromachining, Capacitors, Dielectrics, Semiconducting wafers

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Proceedings Article | 10 April 2000 Paper

Silicon micro-electro-mechanical systems for millimeter-wave applications

Katia Grenier, Patrick Pons, T. Parra, Robert Plana, Jacques Graffeuil

Proceedings Volume 4019, (2000) https://doi.org/10.1117/12.382269

KEYWORDS: Bridges, Switches, Microelectromechanical systems, Micromachining, Silicon, Microwave radiation, Photoresist materials, Molecular bridges, Gold, Electromagnetism

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Showing 5 of 10 publications

Conference Committee Involvement (9)

Smart Sensors, Actuators, and MEMS VI

24 April 2013 | Grenoble, France

Smart Sensors, Actuators and MEMS

18 April 2011 | Prague, Czech Republic

Smart Sensors, Actuators and MEMS

4 May 2009 | Dresden, Germany

Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems IV

10 December 2008 | Melbourne, Australia

Smart Sensors, Actuators and MEMS

2 May 2007 | Maspalomas, Gran Canaria, Spain

Showing 5 of 9 Conference Committees

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