Heat-assisted magnetic recording (HAMR), also known as hybrid recording, is one of the technologies proposed for extending hard disk drive areal densities beyond a Tb/in2. Due to their planar nature and compatibility with existing hard disk drive head fabrication techniques, dielectric optical waveguides have been suggested as a means for delivering light directly to the recording medium or near field optical transducer. In this paper we present spin stand experimental results from a dielectric optical slab waveguide fabricated on an AlTiC slider.
Understanding the proximity effect is crucial to fabricating repeatable sub-100 nm features for magnetic recording devices. Top down CD-SEM measurements have been used to measure the proximity effect parameters in negative and positive resists at dimensions below 100 nm. The goal of this work is to experimentally determine the values of the parameters α, β and η and what they depend on.
We have implemented traditional CD-SEM metrology complimented with the 3D imaging capability of the VERASEM 3D CD-SEM from Applied Materials. 3D imaging is performed by tilting the SEM beam to capture images at two unique angles. Reconstruction of these images allows for the determination of resist thickness and sidewall angle at the same point the critical dimension, CD, is measured. These three output parameters provide the user with automated multi-metric lithographic process control. We have used these techniques to characterize e-beam lithography of isolated lines in ~0.6μm of negative resist at CDs between ~50 and ~100 nm. The flexibility of our e-beam lithography system allows us to expose an array of identical features with 30 distinct dose values over a small area of a wafer. We have characterized the resist CD and thickness as a function of small incremental decreases in dose. As the dose decreases so does the CD of the isolated resist line at a rate of ~1 nm per 1μC/cm2 of area exposure. At a nominally high dose where the isolated line CD is ~100 nm the resist is measured by 3D imaging to be close to full thickness. The main observation is that the resist thickness erodes at a rate of ~5 nm in height per every 1nm decrease in CD down to the resolution limit of 50-60 nm. As the dose is further lowered the resist is then completely washed away. This subtle but significant loss in resist etch mask integrity could not have been observed by traditional top-down CD-SEM metrology alone. This also demonstrates the tilt capability of the VERASEM 3D to measure very thin resist films of ~100 nm. Additionally, we have successfully used this methodology to characterize this effect as a function of isolated line length from ~0.5-2.0μm, and resist thickness from ~0.25-0.6 μm. The CD is strongly correlated with the total isolated line length due to the e-beam proximity effect, while the resist erosion rate remains fairly constant. The resist erosion rate is also similar for the resist films regardless of initial thickness. However, we also confirm the trend that identical area doses produce larger CDs for thicker resist films with some subtle effects for the thinner films.
An electron beam lithography method for printing and plating sub-50 nm isolated trenches with a high aspect ratio has been developed for the nanofabrication of magnetic thin film heads. To eliminate the issues of resist footing and resist residue in the narrow trench process, we put a thin dissolution layer of polymethylglutarimide (PMGI) as an undercoat layer between a seed layer and a resist layer. The undercoat dissolution layer competely cleared off the seed layer by the developer solution such that the sides of the narrow trench are vertical, particularly at the bottom of the narrow trench, thus facilitating plating the narrow trench with a high magnetic moment material. In this work, the narrow trenches were electroplated with both 1.0T NiFe and 1.8T CoNiFe. Three key issues in our trench process will be discussed here, including: 1) critieria for the selection of the undercoat dissolution layer materials; 2) processing conditions control , e.g. the thickness and the bake temperature of the dissolution layer to achieve vertical and smooth sidewalls; and 3) PEB delay on the narrow trench CD control, pattern degeneration, and the results from the resist top coat (RTC) experiments. With our new narrow trench process, we demonstrated the capability of fabricating narrow electrodeposited magnetic write structures with a CD of 35 nm in 0.35 μm resist (AR=10:1) and a CD of 30 nm in 0.25 μm resist (AR=8:1).
Electron beam lithography has been implemented with a commercially available DUV chemically amplified positive resist. Post exposure delay stability in vacuum was found to be non-critical. Post exposure delay after removal from vacuum in our clean room is a critical variable, with a change in critical dimension of approximately 0.6 nm per minute of PEB delay. This result was achieved without amine filtration. Wafers were transported in cassettes from the e- beam exposure tool to an FSI Polaris 2000 photocluster tool. The PEB delay effect on critical dimensions can be significantly reduced by using a water soluble protective top coat with a slight change in nominal does. E-beam lithography was performed with a Leica VB6 operating at 50eV, using a n 800 micrometers field, and a 12.5 nm minimum grid size. The original CAD had a negative bias added to compensate for any proximity effect, to take advantage of dose control to achieve targeted line width, and to optimize exposure latitude. Characterization with a dual beam FIB/SEM to obtain cross-sectional SEM images, typically demonstrate a foot on plated structures from the initial resist profile. A 30 percent decease in nominal dose was observed on device wafers compared to scout wafers. Device wafers have metal structures buried below the approximate 100 nm thick plating seed layer that also cause profile changes. This is presumably due to the back scattering of the electrons from the initial area of exposure. Plating rates in isolated trenches also show a strong dependence o n the critical dimension of the narrow resist trench. Plated structures with critical dimensions of 80 nm in 0.65 microns of resist were fabricated.
William Ross, James Karins, Theodore Maki, John Lucas, Louis Kelly, Niels Jacksen, Jaekyong Cho, David Lambeth, Tan Le, Keith Mountfield, Suresh Santhanam, Daniel Stancil, Mark Randles, Jonathan Whitlock, Dennis Garrity
This paper is a report on the characteristics of a new high resolution, high frame rate, reflected R-MOSLM. This effort is aimed at the production of Miniature Ruggedized Optical Correlators for Optical Pattern Recognition. Pixel size is under one mil center to center, one-third the dimension of present transmission mode devices, thereby reducing the optical path length by an order of magnitude. This development includes optimization of the optical and functional characteristics of the MOSLM for Mil Spec Systems.
William Ross, James Karins, Theodore Maki, John Lucas, Louis Kelly, Jaekyong Cho, David Lambeth, Tan Le, Keith Mountfield, Suresh Santhanam, Daniel Stancil, Mark Randles, Jonathan Whitlock, Dennis Garrity
This paper is a report on the advanced development and characteristics of a new high resolution, high frame rate, reflected R-MOSLM. This effort is aimed at the production of miniature ruggedized optical correlators (MROC) for optical pattern recognition. Pixel size is under one mil center to center, one third the dimension of present transmission mode devices, thereby reducing the optical path length by an order of magnitude. This development includes optimization of the optical and functional characteristics of the MOSLM for Mil Spec Systems. The device research and process development has been performed at Carnegie Mellon University NSF Data Storage System Center under contract from Litton Data Systems. The Litton Electron Device Division is transitioning the device to production. The MROC system description is described in companion paper (1959-09).
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