To fabricate deep-ultraviolet(DUV)-LEDs with high efficiency, the crystallinity of AlGaN must be improved, and is significantly influenced by that of the underlying AlN template. The face-to-face annealed sputter-deposited AlN templates (FFA Sp-AlN) on sapphire have achieved screw- and edge-dislocation densities (TDDs) of 10^4 cm^-2 and 10^7cm^-2. Reduction of TDDs in FFA Sp-AlN and surface flattening of AlxGa1−xN grown on the FFA Sp-AlN play important roles to achieve a high external quantum efficiency (EQE). After the MOVPE homoepitaxial growth of AlN, the FFA Sp-AlN exhibits ideally smooth surface morphology. The EQE of the UV-C LED fabricated on FFA Sp-AlN increased with the TDD reduction of the FFA Sp-AlN. Maximum EQE of 8.0% and output power of 6.6 mW at a 20-mA input were achieved with the peak emission wavelength of 263 nm. We also fabricated 230 nm and 236 nm LEDs on the FFA Sp-AlN templates.
In this study, growth of crack-free AlGaN-based UVC LEDs using face-to-face high-temperature annealed AlN templates on 6-inch sapphire substrates was investigated by production scale metal-organic chemical vapor deposition (MOCVD). The utilization of face-to-face annealed sputtered-deposited thin AlN films templates successfully mitigated wafer bowing, leading to crack-free growth. Additionally, single-peak UVC emissions were obtained in the growth of 6-inch × 7-wafers, and the in-plane uniformity of (Max – Min) / Average was approximately 1.6%. Face-to-face high-temperature annealed AlN proves to be suitable for growing large-diameter UVC LEDs wafers, paving the way for mass production.
For the realization of highly efficient deep-ultraviolet light-emitting diodes (DUV-LEDs) based on III-nitride semiconductors, it is essential to improve the crystalline quality of the AlN templates for crystal growth of AlGaN. Our group has suggested sputtering deposition and post-deposition high-temperature face-to-face annealing (FFA) as a fabrication method of AlN films with low threading dislocation density (TDD) on sapphire substrates. Although the FFA enables reduction of TDDs, it possibly causes a cracking for AlN films due to a large thermal expansion coefficient mismatch between AlN and sapphire. In this work, we controlled the residual stress in AlN films by modifying the sputtering conditions. Consequently, we achieved crack-free AlN films with low TDDs.
A combination of the sputtering deposition and high-temperature annealing is a promising technique for preparing low-dislocation-density AlN templates. In this talk, MOVPE growth behavior of AlGaN films grown on the annealed AlN templates and on conventional MOVPE-grown AlN templates was comprehensively discussed. The low density of screw- and mixed-type dislocations of the annealed AlN templates invoked the formation of hillock structures. By adjusting the MOVPE growth conditions and utilizing sapphire substrates with appropriate surface off-cut, dislocation-induced hillock structures were suppressed. Improved surface flatness resulted in higher EQE and better wavelength uniformity of the DUV-LED fabricated on the annealed AlN templates.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.