As technology nodes go down to 45nm and below, mask metrology becomes more important as the critical features
decrease in size, while, at the same time, the number of measurements that need to be performed increases. OPC and
RET put further burden on metrology as it is typical to measure more than one dimension on a single feature. In order to
maximize the throughput of metrology tools and to keep up with the demand for more measurements, we have
implemented the ability to measure multiple CD sites within a field of view without any stage movement in fully
automated ways in a production environment. This in turn reduces total mask measurement time and helps to increase
tool capacity
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