TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40˚C to 125˚C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina’s selfhermetic flip-chip VCSEL are discussed. TriLumina’s VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.
Proc. SPIE. 10938, Vertical-Cavity Surface-Emitting Lasers XXIII
KEYWORDS: Vertical cavity surface emitting lasers, Modulation, Aluminum nitride, Distance measurement, Light sources and illumination, Time of flight imaging, Time of flight cameras, Time of flight range image sensors, LIDAR
The design and optimization of two-dimensional VCSEL arrays operating with duty-cycles from 2 to 5% (quasicontinuous- wave or QCW) operating at 940 nm are presented. Designs for nominal 8 W and 100 W peak power using TriLumina’s flip-chip-bondable, back-side-emitting VCSELs are reviewed. Performance as a function of duty cycle, including peak power output, spectral width and beam divergence are presented. Performance from -40°C to 125°C, corresponding to automotive grade 1 requirements, is reviewed. Optimization of the VCSEL arrays as a function of the number of emitters per chip is analyzed for trends in wall-plug efficiency, slope efficiency and operating conditions.