Dr. Lin Hu Profile

Dr. Lin Hu

at GLOBALFOUNDRIES Inc

SPIE Involvement:

Author

Publications (4)

SPIE Journal Paper | 7 February 2017

Design technology co-optimization assessment for directed self-assembly-based lithography: design for directed self-assembly or directed self-assembly for design?

Kafai Lai, Chi-Chun Liu, Hsinyu Tsai, Yongan Xu, Cheng Chi, Ananthan Raghunathan, Parul Dhagat, Lin Hu, Oseo Park, Sunggon Jung, Wooyong Cho, Jaime Morillo, Jed Pitera, Kristin Schmidt, Mike Guillorn, Markus Brink, Daniel Sanders, Nelson Felix, Todd Bailey, Matthew Colburn

JM3, Vol. 16, Issue 01, 013502, (February 2017) https://doi.org/10.1117/12.10.1117/1.JMM.16.1.013502

KEYWORDS: Directed self assembly, Resolution enhancement technologies, Lithography, Metals, Optical lithography, Photomasks, 3D modeling, Computational lithography, Optical proximity correction

Read Abstract +

Proceedings Article | 10 May 2016 Paper

Development of a new high transmission phase shift mask technology for 10 nm logic node

Thomas Faure, Yoshifumi Sakamoto, Yusuke Toda, Karen Badger, Kazunori Seki, Mark Lawliss, Takeshi Isogawa, Amy Zweber, Masayuki Kagawa, Richard Wistrom, Yongan Xu, Granger Lobb, Ramya Viswanathan, Lin Hu, Yukio Inazuki, Kazuhiro Nishikawa

Proceedings Volume 9984, 998402 (2016) https://doi.org/10.1117/12.2241480

KEYWORDS: Photomasks, Phase shifts, Logic, Lithography, Chromium, Inspection, Opacity, SRAF, Etching, Attenuators

Read Abstract +

Proceedings Article | 1 April 2016 Paper

Lithographic qualification of high-transmission mask blank for 10nm node and beyond

Yongan Xu, Tom Faure, Ramya Viswanathan, Granger Lobb, Richard Wistrom, Sean Burns, Lin Hu, Ioana Graur, Ben Bleiman, Dan Fischer, Yann Mignot, Yoshifumi Sakamoto, Yusuke Toda, John Bolton, Todd Bailey, Nelson Felix, John Arnold, Matthew Colburn

Proceedings Volume 9780, 978006 (2016) https://doi.org/10.1117/12.2219778

KEYWORDS: Photomasks, Semiconducting wafers, Optical proximity correction, Lithography, Transmittance, Resolution enhancement technologies, Printing, SRAF, Critical dimension metrology, Phase shifts

Read Abstract +

Proceedings Article | 28 March 2016 Paper

Multi-layer VEB modeling: capturing interlayer etch process effects for multi-patterning process

Lin Hu, Sunwook Jung, Jianliang Li, Young Kim, Yuval Bar, Granger Lobb, Jim Liang, Atsushi Ogino, John Sturtevant, Todd Bailey

Proceedings Volume 9780, 97800N (2016) https://doi.org/10.1117/12.2219237

KEYWORDS: Etching, Metals, Reactive ion etching, Cadmium, Optical proximity correction, Data modeling, Semiconducting wafers, 3D modeling, Back end of line, Image processing

Read Abstract +

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years