Dummy fill plays a crucial role on both controlling topography uniformity and ensuring device performance by
manipulating homogenous pattern density. There are several types of fill to achieve this purpose on advanced
technologies. The conventional way is to place them out of optical ambit range from main features as reference for
Optical Proximity Correction (OPC) procedure, but it degrades the FILL performance due to leaving considerable empty
space between FILL and main features. The aggressive way is to place FILL as close as main features to perfectly
achieve uniform pattern density. However, in this way, it’s challenge to produce defect-free FILL in ORC (Optical
Review Check) without applying model-based OPC on FILL which boost the OPC cycle time significantly. In this paper,
we propose a novel approach by in-stage Repair OPC technique to not only accurately print aggressive placement FILL
on the wafer accurately but also reduce the impact of run time cost on full chip OPC processing.
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