CONFERENCE PROCEEDINGS
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Masaki Mizutani
at Canon Inc
SPIE Involvement:
Author
Publications (5)
Proceedings Article | 26 August 2024 Paper
Solutions enabling advanced packaging and heterogeneous integration
Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura
Proceedings Volume 13177, 1317706 (2024) https://doi.org/10.1117/12.3032559
KEYWORDS: Advanced packaging, Packaging, Reticles, Distortion, Optical lithography, Semiconductors
Proceedings Article | 10 April 2024 Presentation + Paper
Study of patterning for advanced packaging
Ken-Ichiro Mori, Douglas Shelton, Masaki Mizutani, Hiromi Suda, Ken-ichiro Shinoda, Seiya Miura
Proceedings Volume 12953, 129530W (2024) https://doi.org/10.1117/12.3010657
KEYWORDS: Silicon, Distortion, Glasses, Packaging, Optical lithography, Advanced packaging, Lithography
SPIE Journal Paper | 2 January 2024
Study of submicron-resolution, high-accuracy overlay and large-field lithography for advanced packaging
Ken-ichiro Shinoda, Douglas Shelton, Masaki Mizutani, Ken-Ichiro Mori, Hiromi Suda
JM3, Vol. 23, Issue 01, 011004, (January 2024) https://doi.org/10.1117/12.10.1117/1.JMM.23.1.011004
KEYWORDS: Distortion, Silicon, Overlay metrology, Artificial intelligence, Optical lithography, Light sources and illumination, Critical dimension metrology, Aspheric lenses, Advanced packaging, Submicron lithography
Proceedings Article | 22 November 2023 Presentation
Lithography solutions enabling advanced packaging and heterogeneous integration applications
Doug Shelton, Hiromi Suda, Ken-Ichiro Mori, Ken-Ichiro Shinoda, Yoshio Goto, Kosuke Urushihara, Masaki Mizutani, Yusuke Tokuyama
Proceedings Volume PC12751, PC127510C (2023) https://doi.org/10.1117/12.2687747
KEYWORDS: Advanced packaging, Lithography, Semiconducting wafers, Silicon, Reticles, Integrated circuits, Distortion
Proceedings Article | 12 April 2013 Paper
A study of vertical lithography for high-density 3D structures
Masaki Mizutani, Shin-Ichiro Hirai, Ichiro Koizumi, Ken-Ichiro Mori, Seiya Miura
Proceedings Volume 8683, 86831F (2013) https://doi.org/10.1117/12.2011340
KEYWORDS: Lithography, Semiconducting wafers, Silicon, Photomasks, Optical alignment, Chemically amplified resists, Semiconductors, Optical lithography, Plating, Critical dimension metrology
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