Proceedings Article | 4 March 2019
Proc. SPIE. 10930, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XII
KEYWORDS: Fabrication, Consumer electronics, Lithography, Electron beam lithography, Medicine, Electrodes, Optoelectronic devices, Telecommunications, Nanolithography, Lead
Nanoscale optoelectronic devices based on coplanar nanogap electrodes, when compared with traditional vertical devices, exhibit attractive characteristics, such as high density of integration, high sensitivity, fast response and multifunctionality. Moreover, their low-cost high-throughput fabrication on flexible disposable substrates opens up several new applications in sectors ranging from telecommunications and consumer electronics to healthcare - to name a few. However, their commercial exploitation has been hitherto impeded by technological bottlenecks, owing to the incompatibility of currently available fabrication techniques, eg. e-beam lithography, with industrial upscaling.
Adhesion lithography is a nanopatterning technique that allows the facile high yield fabrication of coplanar metal electrodes separated by a sub-15 nm gap on large area substrates of any type, including plastic. These electrodes, when combined with solution-processed and/or low-dimensional nanostructured materials deposited at low, plastic-compatible, temperatures give rise to nanoscale optoelectronic devices with intriguing properties.
It will be shown that both nanoscale light-emitting and light-sensing devices can be fabricated upon using light-emitting polymers along with self-assembling surface modifiers, and lead halide perovskites and functionalised colloidal PbS quantum dots, respectively. Emphasis will be given in recent advances in flexible nanoscale photodetectors fabricated with nanogap coplanar electrodes, operating in DUV up to NIR part of the spectrum. These devices exhibit high responsivity, sensitivity and fast response speed (hundreds of nanoseconds) owing to the extreme downscaling of key device dimensions. These results demonstrate that adhesion lithography combined with advanced materials concepts constitutes a new fabrication paradigm enabling a plethora of advanced applications within the field of flexible electronics.
