Mr. Masami Aoki Profile

Masami Aoki

PCS Director at KLA Japan

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Author

Publications (5)

Proceedings Article | 2 April 2014 Paper

Defect analysis methodology for contact hole grapho epitaxy DSA

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Shinichiro Kawakami, Takashi Yamauchi, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Takahiro Kitano

Proceedings Volume 9050, 905027 (2014) https://doi.org/10.1117/12.2046051

KEYWORDS: Inspection, Wafer-level optics, Scanning electron microscopy, Wafer inspection, Defect detection, Semiconducting wafers, Optical lithography, Epitaxy, Defect inspection, Directed self assembly

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Proceedings Article | 18 April 2013 Paper

DSA hole defectivity analysis using advanced optical inspection tool

Ryota Harukawa, Masami Aoki, Andrew Cross, Venkat Nagaswami, Tadatoshi Tomita, Seiji Nagahara, Makoto Muramatsu, Shinichiro Kawakami, Hitoshi Kosugi, Benjamen Rathsack, Takahiro Kitano, Jason Sweis, Ali Mokhberi

Proceedings Volume 8681, 86811A (2013) https://doi.org/10.1117/12.2011177

KEYWORDS: Inspection, Semiconducting wafers, Wafer inspection, Reticles, Wafer-level optics, Epitaxy, Optical inspection, Defect inspection, Optical lithography, Directed self assembly

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Proceedings Article | 24 March 2009 Paper

Development of a novel methodology for effective partial die inspection and monitoring

Byoung-Ho Lee, Tae-Yong Lee, Andrew Cross, Masami Aoki, HeungSoo Choi, YeonHo Pae

Proceedings Volume 7272, 72723K (2009) https://doi.org/10.1117/12.813994

KEYWORDS: Inspection, Semiconducting wafers, Yield improvement, Defect inspection, Wafer inspection, Reticles, Signal processing, Electronics, Semiconductors, Contamination

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Proceedings Article | 16 April 2008 Paper

Defect criticality index (DCI): a new methodology to significantly improve DOI sampling rate in a 45nm production environment

Yoshiyuki Sato, Yasuyuki Yamada, Yasuhiro Kaga, Yuuichiro Yamazaki, Masami Aoki, David Tsui, Chris Young, Ellis Chang

Proceedings Volume 6922, 692213 (2008) https://doi.org/10.1117/12.771917

KEYWORDS: Scanning electron microscopy, Inspection, Semiconducting wafers, Particles, Wafer inspection, Defect detection, Environmental sensing, Defect inspection, Environmental monitoring, Metals

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Proceedings Article | 24 July 1996 Paper

Subquarter-micron lithography with dual-trench-type alternating PSM

Hideki Kanai, Kenji Kawano, Satoshi Tanaka, Eishi Shiobara, Masami Aoki, Ikuo Yoneda, Shinichi Ito

Proceedings Volume 2793, (1996) https://doi.org/10.1117/12.245213

KEYWORDS: Photomasks, Picosecond phenomena, Error analysis, Lithography, Phase shift keying, Phase shifts, Etching, Quartz, Opacity, Modulation

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