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Masashi Yamabe
at Yokohama National Univ
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Publications (1)
Proceedings Article | 21 December 2007 Paper
Reliability evaluation for solder joints in embedded electronic package
Masashi Yamabe, Qiang Yu, Tadahiro Shibutani, Hiroki Miyauchi, Masaki Shiratori, Hideki Ohhashi
Proceedings Volume 6798, 67980S (2007) https://doi.org/10.1117/12.759410
KEYWORDS: Reliability, Packaging, Lead, Electronic components, Epoxies, Silicon, Integrated circuits, Polyurethane, Prototyping, Manufacturing
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