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Dr. Maxime Darnon
Adjunct Professor & Researcher at CNRS-LN2
SPIE Involvement:
Author
Publications (5)
Proceedings Article | 4 March 2022 Presentation + Paper
Sub-millimeter-scale multijunction solar cells for concentrator photovoltaics (CPV)
Maxime Darnon, Mathieu de Lafontaine, Pierre Albert, Corentin Jouanneau, Thomas Bidaud, Christian Dubuc, Maïté Volatier, Vincent Aimez, Abdelatif Jaouad, Gwenaelle Hamon
Proceedings Volume 11996, 1199608 (2022) https://doi.org/10.1117/12.2613441
KEYWORDS: Solar cells, Semiconducting wafers, Plasma etching, Multijunction solar cells, Photovoltaics, Solar concentrators, Sun, Etching, Semiconductors, Plasma
Proceedings Article | 17 March 2015 Paper
Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approach
Emmanuel Dupuy, E. Pargon, M. Fouchier, H. Grampeix, J. Pradelles, M. Darnon, P. Pimenta-Barros, S. Barnola, O. Joubert
Proceedings Volume 9428, 94280B (2015) https://doi.org/10.1117/12.2085812
KEYWORDS: Line edge roughness, Line width roughness, Plasma, Etching, Critical dimension metrology, Plasma etching, Silicon, Oxygen, Photoresist processing, Neodymium
Proceedings Article | 29 March 2013 Paper
Characterization of silicon etching in synchronized pulsed plasma
M. Darnon, M. Haass, G. Cunge, O. Joubert, S. Banna
Proceedings Volume 8685, 86850J (2013) https://doi.org/10.1117/12.2011462
KEYWORDS: Plasma, Ions, Etching, Silicon, Plasma etching, Oxygen, Semiconducting wafers, Information operations, Mass spectrometry
Proceedings Article | 17 March 2012 Paper
Towards new plasma technologies for 22nm gate etch processes and beyond
O. Joubert, M. Darnon, G. Cunge, E. Pargon, D. Thibault, C. Petit-Etienne, L. Vallier, N. Posseme, P. Bodart, L. Azarnouche, R. Blanc, M. Haas, M. Brihoum, S. Banna, T. Lill
Proceedings Volume 8328, 83280D (2012) https://doi.org/10.1117/12.920312
KEYWORDS: Plasma, Etching, Silicon, Ions, Plasma etching, Semiconducting wafers, Silica, Oxides, Oxidation
Proceedings Article | 17 March 2012 Paper
Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching process
T. Chevolleau, G. Cunge, M. Delalande, X. Chevalier, R. Tiron, S. David, M. Darnon, C. Navarro
Proceedings Volume 8328, 83280M (2012) https://doi.org/10.1117/12.916399
KEYWORDS: Etching, Silicon, Picosecond phenomena, Plasma, Silica, Photomasks, Plasma etching, Oxygen, Scanning electron microscopy, Optical lithography
Conference Committee Involvement (12)
Advanced Etch Technology and Process Integration for Nanopatterning XII
28 February 2023 | San Jose, California, United States
Advanced Etch Technology and Process Integration for Nanopatterning XI
26 April 2022 | San Jose, California, United States
Advanced Etch Technology and Process Integration for Nanopatterning X
22 February 2021 | Online Only, California, United States
Advanced Etch Technology for Nanopatterning IX
25 February 2020 | San Jose, California, United States
Advanced Etch Technology for Nanopatterning VIII
25 February 2019 | San Jose, California, United States
Showing 5 of 12 Conference Committees
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