Ms. Mayuka Osaki Profile

Mayuka Osaki

at Hitachi Ltd

SPIE Involvement:

Author

Publications (14)

Proceedings Article | 10 April 2024 Poster

Three-dimensional global uniformity control in plasma etcher using multi parameter profile characterization technique based on CD-SEM image

Makoto Satake, Chisaki Takubo, Tadashi Okumura, Kenji Yasui, Hitoshi Namai, Takahiro Kawasaki, Mayuka Osaki, Maki Tanaka

Proceedings Volume 12955, 129553K (2024) https://doi.org/10.1117/12.3011778

KEYWORDS: Plasma etching, Plasma, 3D image processing, Semiconducting wafers, Critical dimension metrology, Control systems, Temperature control, Semiconductors, Gallium arsenide, Field effect transistors

Proceedings Article | 10 April 2024 Poster + Paper

A method for dynamic placement of overlay measurement area cursors using segmentation technique

Shinya Kyogoku, Minoru Harada, Mayuka Osaki, Takahiro Nishihata, Yasunori Goto

Proceedings Volume 12955, 1295521 (2024) https://doi.org/10.1117/12.3008535

KEYWORDS: Overlay metrology, Image segmentation, Edge detection, Scanning electron microscopy, Image processing, Deep learning, Target recognition, Semiconductors

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Proceedings Article | 10 April 2024 Presentation + Paper

Cu pad surface height evaluation technique by in-line SEM for wafer hybrid bonding

Hiroaki Kasai, Mayuka Osaki, Kazuhisa Hasumi, Nobuyuki Mise, Maki Tanaka, Bensu Tunca Altintas, Soon Aik Chew, Janusz Bogdanowicz, Alain Moussa, Mohamed Saib, Boyao Zhang, Anne-Laure Charley

Proceedings Volume 12955, 129551N (2024) https://doi.org/10.1117/12.3008658

KEYWORDS: Copper, Semiconducting wafers, Scanning electron microscopy, Wafer bonding, Sensors, Atomic force microscopy, Signal detection, Image sensors, Chemical mechanical planarization, Target detection

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SPIE Journal Paper | 1 March 2023

Quantification of three-dimensional pattern-shape variation with CD-SEM top-down image

Mayuka Osaki, Kenji Yasui, Maki Tanaka, Hitoshi Namai, Yuki Ojima

JM3, Vol. 22, Issue 02, 021008, (March 2023) https://doi.org/10.1117/12.10.1117/1.JMM.22.2.021008

KEYWORDS: Semiconducting wafers, 3D image processing, Scanning electron microscopy, Education and training, Signal detection, Electron beams, Tolerancing, Image analysis, Target detection, Semiconductors

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Proceedings Article | 13 June 2022 Poster

A method for quantifying the three-dimensional shape of circuit patterns with a top-down CD-SEM image

Kenji Yasui, Mayuka Osaki, Hitoshi Namai, Yuki Ojima, Masami Ikota, Maki Tanaka

Proceedings Volume PC12053, PC120530R (2022) https://doi.org/10.1117/12.2614738

KEYWORDS: 3D metrology, 3D image processing, Scanning electron microscopy, 3D acquisition, Electron microscopes, Semiconducting wafers, Optical lithography, Image processing, Critical dimension metrology, Visualization

Proceedings Article | 26 March 2019 Paper

Depth measurement technique for extremely deep holes using back-scattered electron images with high voltage CD-SEM

Takahiro Nishihata, Mayuka Osaki, Maki Tanaka, Takuma Yamamoto, Akira Hamaguchi, Chihiro Ida, Yusaku Suzuki

Proceedings Volume 10959, 109591B (2019) https://doi.org/10.1117/12.2514799

KEYWORDS: 3D metrology, Scanning electron microscopy, Monte Carlo methods, Calibration, 3D acquisition, Scattering, Nondestructive evaluation

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SPIE Journal Paper | 1 January 2011

Accurate measurement of very small line patterns in critical dimension scanning electron microscopy using model-based library matching technique

Chie Shishido, Maki Tanaka, Mayuka Osaki

JM3, Vol. 10, Issue 1, 013010, (January 2011) https://doi.org/10.1117/12.10.1117/1.3541780

KEYWORDS: Critical dimension metrology, Atomic force microscopy, Scanning electron microscopy, Critical dimension scanning electron microscopy, Monte Carlo methods, Model-based design, Silicon, Statistical analysis, Cadmium, Image processing

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Proceedings Article | 2 April 2010 Paper

Application of model-based library approach to photoresist pattern shape measurement in advanced lithography

Naoki Yasui, Miki Isawa, Toru Ishimoto, Kohei Sekiguchi, Maki Tanaka, Mayuka Osaki, Chie Shishido, Norio Hasegawa, Shaunee Cheng

Proceedings Volume 7638, 76382O (2010) https://doi.org/10.1117/12.846504

KEYWORDS: Photoresist materials, Lithography, Critical dimension metrology, Scanning electron microscopy, Lithographic illumination, Model-based design, Process control, Mathematical modeling, Immersion lithography, Semiconducting wafers

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Proceedings Article | 2 April 2010 Paper

CD bias reduction in CD-SEM of very small line patterns: sidewall shape measurement using model-based library matching method

Chie Shishido, Maki Tanaka, Mayuka Osaki

Proceedings Volume 7638, 76383I (2010) https://doi.org/10.1117/12.846402

KEYWORDS: Critical dimension metrology, Atomic force microscopy, Scanning electron microscopy, Monte Carlo methods, Silicon, Model-based design, Image processing, Statistical analysis, Cadmium, Scattering

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Proceedings Article | 24 March 2009 Paper

High-precision CD matching monitoring technology using profile gradient method for the 32-nm technology generation

Toru Ikegami, Akemi Kono, Tatsuya Maeda, Mayuka Osaki, Chie Shishido

Proceedings Volume 7272, 72722N (2009) https://doi.org/10.1117/12.813968

KEYWORDS: Critical dimension metrology, Scanning electron microscopy, Semiconducting wafers, Semiconductors, Image resolution, Electron beams, Contamination, Metrology, Electron microscopes, Optical alignment

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Proceedings Article | 24 March 2009 Paper

CD-bias reduction in CD-SEM line-width measurement for the 32-nm node and beyond using the model-based library method

Chie Shishido, Maki Tanaka, Mayuka Osaki

Proceedings Volume 7272, 72722C (2009) https://doi.org/10.1117/12.813948

KEYWORDS: Critical dimension metrology, Atomic force microscopy, Monte Carlo methods, Silicon, Beam shaping, Model-based design, Scanning electron microscopy, Scattering, Silica, Mathematical modeling

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Proceedings Article | 23 March 2009 Paper

Performance verification of resist loss measurement method using top-view CD-SEM images for hyper-NA lithography

Mayuka Osaki, Maki Tanaka, Chie Shishido, Shaunee Cheng, David Laidler, Monique Ercken, Efrain Altamirano

Proceedings Volume 7272, 727211 (2009) https://doi.org/10.1117/12.813472

KEYWORDS: Etching, Semiconducting wafers, Surface roughness, Finite element methods, Scanning electron microscopy, Lithography, Atomic force microscopy, Critical dimension metrology, Atomic force microscope, Photoresist processing

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Proceedings Article | 16 April 2008 Paper

Advanced CD-SEM metrology to improve total process control performance for hyper-NA lithography

Mayuka Osaki, Maki Tanaka, Chie Shishido, Toru Ishimoto, Norio Hasegawa, Kohei Sekiguchi, Kenji Watanabe, Shaunee Cheng, David Laidler, Monique Ercken, Efrain Altamirano

Proceedings Volume 6922, 69221B (2008) https://doi.org/10.1117/12.771886

KEYWORDS: Critical dimension metrology, Etching, Photoresist processing, Lithography, Scanning electron microscopy, Semiconducting wafers, Finite element methods, Signal attenuation, Process control, Metrology

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Proceedings Article | 24 March 2006 Paper

Image resolution monitoring technique for CD-SEM

Mayuka Oosaki, Chie Shishido, Hiroki Kawada, Robert Steffen

Proceedings Volume 6152, 615243 (2006) https://doi.org/10.1117/12.655982

KEYWORDS: Image resolution, Scanning electron microscopy, Monte Carlo methods, Optical simulations, Spatial frequencies, Correlation function, Spatial resolution, Interference (communication), Fourier transforms, Process control

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Showing 5 of 14 publications

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