In this work, we propose a method to discriminate between upper and lower side material removal during double side polishing of fused silica parts. It consists in engraving cone-shaped craters on the two sides, then measuring the profile of each crater before/after a polishing run. The comparison of the profiles leads to the thickness removed on each side during the run. The craters have been engraved using a CO2 laser and their profiles measured thanks to a nano-scratcher. We have evaluated that this method can determine material removal with an accuracy of about 1μm, is insensitive to a part repositioning error under the tip of about 35μm, and has a repeatability of 0.5μm. Finally, we have been able to measure effective removal differences of 2μm between the two sides.
We have selected and characterized 2 cerium oxide slurries. We have then modified their pH to polish fused silica samples. The material removal rate, roughness, surface defects density and morphology have been observed as a function of pH. We noticed that while roughness and surface defect density don’t seem to be very affected by slurry pH, the latter has an influence on material removal rate and width of the scratches generated during polishing.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.