Mr. Michael B. Pike Profile

Michael B. Pike

at GLOBALFOUNDRIES Inc

SPIE Involvement:

Author

Publications (7)

SPIE Journal Paper | 2 May 2016

Intrafield overlay correction for illumination-based distortion

Michael Pike, Timothy Brunner, Bradley Morgenfeld, Nan Jing, Timothy Wiltshire

JM3, Vol. 15, Issue 02, 021406, (May 2016) https://doi.org/10.1117/12.10.1117/1.JMM.15.2.021406

KEYWORDS: Overlay metrology, Distortion, Scanners, Reticles, Image processing, Semiconducting wafers, Error analysis, Optical alignment, Photomasks, Calibration

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Proceedings Article | 18 March 2015 Paper

Intra-field overlay correction for illumination based distortion

Michael Pike, Timothy Brunner, Timothy Wiltshire, Bradley Morgenfeld, Nan Jing

Proceedings Volume 9426, 942613 (2015) https://doi.org/10.1117/12.2085887

KEYWORDS: Overlay metrology, Scanners, Distortion, Reticles, Semiconducting wafers, Optical lithography, Photomasks, Optical alignment, Lithographic illumination, Error analysis

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Proceedings Article | 31 March 2014 Paper

Characterization and mitigation of overlay error on silicon wafers with nonuniform stress

T. Brunner, V. Menon, C. Wong, N. Felix, M. Pike, O. Gluschenkov, M. Belyansky, P. Vukkadala, S. Veeraraghavan, J. Sinha, C. H. Hoo, S. Klein

Proceedings Volume 9052, 90520U (2014) https://doi.org/10.1117/12.2045715

KEYWORDS: Semiconducting wafers, Overlay metrology, Electronic support measures, Distortion, Optical alignment, Metrology, Photomasks, Lithography, Silicon, Laser range finders

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Proceedings Article | 4 April 2012 Paper

High-order wafer alignment in manufacturing

Vinayan Menon, Blandine Minghetti, Michael Pike, Christopher Ausschnitt, Timothy Wiltshire, Nelson Felix, Won Kim, Sheldon Meyers

Proceedings Volume 8324, 832408 (2012) https://doi.org/10.1117/12.916483

KEYWORDS: Optical alignment, Semiconducting wafers, Overlay metrology, Scanners, Manufacturing, Control systems, Semiconductor manufacturing, Data modeling, Process control, Metrology

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Proceedings Article | 4 March 2010 Paper

The GridMapper challenge: how to integrate into manufacturing for reduced overlay error

Timothy Wiltshire, Allen Gabor, Bernhard Liegl, Emily Hwang, Michael Pike

Proceedings Volume 7640, 764015 (2010) https://doi.org/10.1117/12.849225

KEYWORDS: Overlay metrology, Semiconducting wafers, Scanners, Manufacturing, Reticles, Lithography, Optics manufacturing, Laser scanners, 3D scanning, Software development

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Proceedings Article | 23 March 2009 Paper

Cr migration on 193nm binary photomasks

Jed Rankin, Robert Davis, John Bruley, Michael Pike, Frances Houle, Alfred Wagner, Andrew Watts, Philip Flaitz, Geoffrey Burr, Dolores Miller, William Hinsberg

Proceedings Volume 7272, 727215 (2009) https://doi.org/10.1117/12.813934

KEYWORDS: Photomasks, Chromium, Semiconducting wafers, Binary data, Manufacturing, Diffusion, Transmission electron microscopy, Roads, Photoresist materials, Oxidation

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Proceedings Article | 7 July 1997 Paper

New ESCAP-type resist with enhanced etch resistance and its application to future DRAM and logic devices

Robin Keller, Hok Ho, James Cameron, Tina Cotler-Wagner, Fred Buehrer, Will Conley, Michael Cronin, David Dobuzinsky, Peter Hagerty, Timothy Farrell, Juliann Opitz, William Brunsvold, Ronald Nunes, Thomas Zydowsky, Donald Hofer, Jacque Georger, Mike Mori, Gregory Breyta, James Marsh, Michael Pike, George Barclay, Tracy Lindsay, Ron Schulz, Hiroshi Ito, Ronald DellaGuardia, Ahmad Katnani, Hung Ng, Deborah Ryan, Gregory Wallraff, Roger Sinta, James Oberschmidt, Debra Fenzel-Alexander, Matthew Moynihan, Paul Muller, James Thackeray, Sassan Nour

Proceedings Volume 3049, (1997) https://doi.org/10.1117/12.275830

KEYWORDS: Semiconducting wafers, Photoresist materials, Etching, Polymers, Resistance, Lithography, Silicon, Glasses, Annealing, Photoresist processing

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Showing 5 of 7 publications

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