New circuit architectures and technologies for high-speed electronic and photonic integrated circuits are essential to realize optical interconnects with higher symbol rate. As a consequence of the increasing speeds, close integration and co-design of photonic and electronic chips have become a necessity to realize high-performance transceivers with novel packaging approaches. Extensive co-design also enables the design of new electro-optic architectures to create and process optical signals more efficiently. This paper and presentation will illustrate a number of recent developments of application-specific high-speed electro-optic transceiver circuits including e.g. broadband driver amplifiers, transimpedance amplifiers, analog equalizers and multiplexer circuits for signal generation and reception at 100 Gbaud and beyond. The basic concepts and architectures, technological aspects, design challenges and trade-offs will be discussed.
This paper discusses our progress on high-speed optical transmitters for next generation intra-datacenter interconnects.
Silicon integrated photonic systems have a key role to play in this evolution by allowing compact, fast, innovative and
cost-effective devices to be manufactured in large volumes. Especially silicon Mach-Zehnder modulators are a very
attractive candidate: they are easy to manufacture, easy to use and support both intensity as well as coherent modulation.
Key to the next-generation optical transmitter is not only the very high datarates, but also the very small form-factor and
low power consumption. This requires leveraging electro-optic co-design of driver electronics and optical modulators.
One of the main challenges in space communication has always been attempting to meet the demanding requirement for greater capacity and routing complexity associated with Very High Throughput Satellite (VHTS) missions. Increased amounts of hardware associated with such high capacity mission pushes the payload towards limitation in mass, power consumption, thermal dissipation and accommodation on the spacecraft. This paper describes activities and the final demonstration results of the OPTIMA project. OPTIMA is funded by the EU commission under Horizon 2020, COMPET-2-2016, maturing satellite communication technologies. The objective of the OPTIMA project was to demonstrate and validate the concept of significantly improving the SWaP of VHTS payloads by defining and developing a photonic payload hardware demonstrator based on various photonic equipment building blocks and testing the demonstrator to TRL 6. Since photonic technology is not yet mature for use in the space environment, the OPTIMA project developed and environmentally tested to TRL 6 the necessary photonic devices and hardware payload equipment. Benefits offered from the use of photonic technology in VHTS payload architectures have shown significant mass saving. This comes not only from reduced equipment unit mass but also from a lower number of units required as a consequence of implementing photonic technology. There are also additional benefits, including reduced DC power consumption and improved power dissipation. The OPTIMA demonstrator is based on Ka-band frequency; however, a holistic approach has been taken when deriving equipment specifications by considering VHTS payload requirements as a whole to ensure the demonstrator will lead to technology developments that can easily scale up in terms of frequencies (such as Q/V band) and use in a wide range of VHTS payload architectures. During the early part of the OPTIMA project, the specification of each building block has been established with emphasis on RF and optical performance, mass, footprint, power consumption, power dissipation and cost. The OPTIMA project aims to provide a strong initial impulse to the photonic payloads for telecommunication satellites by focusing the efforts of various industrial and academic actors from the European photonic and space landscape towards the concrete goal of demonstrating the validity of the photonic payload concept.
High-speed electronic integrated circuits are essential to the development of new fiber-optic communication systems. As a consequence of the increasing speeds and multi-channel operation, close integration and co-design of photonic and electronic devices have become a necessity to realize high-performance sub-systems. Such co-design on the other hand also enables the design of new electro-optic architectures to create and process multi-level optical signals. This presentation will illustrate a number of recent and ongoing developments in IDLab, an imec research group, from various H2020 projects with a focus on application-specific high-speed electronic transceiver circuits such as driver amplifiers and transimpedance amplifiers (TIAs).
Javad Anzalchi, Joyce Wong, Thibaut Verges, Olga Navasquillo, Teresa Mengual, Miguel Piqueras, Eddie Prevost, Karen Ravel, Nick Parsons, Michael Enrico, Johan Bauwelink, Michael Vanhoecke, Antonello Vannucci, Marcello Tienforti
To address the challenges of the Digital Agenda for Europe (DAE) and also to remain in line with the evolution of terrestrial communications in a globally connected world, a major increase in telecoms satellites capacity is required in the near future.
With telecom satellites payloads based on traditional RF equipment, increase in capacity and flexibility has always translated into a more or less linear increase in equipment count, mass, power consumption and power dissipation.
The main challenge of next generation of High Throughput Satellites (HTS) is therefore to provide a ten-fold-increased capacity with enhanced flexibility while maintaining the overall satellite within a “launchable” volume and mass envelope [1], [2], [3]. Photonic is a very promising technology to overcome the above challenges. The ability of Photonic to handle high data rates and high frequencies, as well as enabling reduced size, mass, immunity to EMI and ease of harness routing (by using fibre-optic cables) is critical in this scenario.
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