Ms. Michaela Braun Profile

Michaela Braun

at Infineon Technologies AG

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 20 March 2020 Presentation + Paper

Three-dimensional feature characterization by inline Xe plasma FIB: delayering and deep milling implementation

Franz Niedermeier, Agnes Fros, Max Böckl, Wolfgang Kipferl, Michaela Braun, Albert Birner, Haim Pearl, Thomas Schubert, Allen Lee

Proceedings Volume 11325, 1132512 (2020) https://doi.org/10.1117/12.2551657

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Process control, 3D metrology, Back end of line, Front end of line, Image quality, 3D image processing, Xenon, Plasma

Read Abstract +

In recent years semiconductor manufacturers have increasingly employed deep through-silicon via (TSV) at the front end of line (FEOL) process steps, combined with using an increased number of multilevel, three-dimensional (3D) layers with different material stack at the back end of line (BEOL) process steps. This increased usage results in enhanced requirements for 3D feature characterization during the process development steps, as well as with monitoring and failure analysis during production.

Traditionally, deep TSV features during the FEOL are analyzed by cleaving (breaking) the wafers and observing the cross section. At the BEOL, focused ion beam (FIB) cross section and etch back or chemical mechanical polishing (CMP) of layer-by-layer are used to characterize the 3D multilevel layers. Both methods result in a slow turnaround time (TAT), but most importantly, cross section analysis only gives two-dimensional (2D) information about 3D multilevel structure and can miss abnormalities. Etch back or CMP has relatively low quality, accuracy, and repeatability and results in full wafer scrap.

Inline Xe plasma FIB (PFIB) has become an important tool for 3D feature characterization and failure analysis in the chip manufacturing production line. Layer-by-layer excavation (also known as delayering) of a specific site provides enhanced metrology and reconstruction of complete 3D features. Thus, manufacturers can identify process abnormalities of the complete structure. Moreover, inline delayering, combined with cross sectioning of specific sites, enhances the TAT. The wafer can return to production for further analysis, and manufacturers can study the effects on different steps.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years