This paper focuses on robotic technologies and operational capabilities of multiscale robots that demonstrate a
unique class of Microsystems with the ability to navigate diverse terrains and environments. We introduce two
classes of robots which combine multiple locomotion modalities including centimeter scale Discrete and Continuous
robots which are referred here by D-Starbot and C-Starbot, respectively. The first generation of the robots were
obtained to allow rapid shape reconfiguration and flipping recovery to accomplish tasks such as lowering and raising
to dexterously go over and under obstacles, deform to roll over hostile location as well as squeezing through opening
smaller than its sizes. The D-Starbot is based on novel mechanisms that allow shape reconfiguration to accomplish
tasks such as lowering and raising to go over and under obstacles as well as squeezing through small voids. The CStarbot
is a new class of foldable robots that is generally designed to provide a high degree of manufacturability. It
consists of flexible structures that are built out of composite laminates with embedded microsystems. The design
concept of C-Starbot are suitable for robots that could emulate and combine multiple locomotion modalities such as
walking, running, crawling, gliding, clinging, climbing, flipping and jumping. The first generation of C-Starbot has
centimeter scale structure consisting of flexible flaps, each being coupled with muscle-like mechanism. Untethered
D-Starbot designs are prototyped and tested for multifunctional locomotion capabilities in indoor and outdoor
environments. We present foldable mechanism and initial prototypes of C-Starbot capable of hopping and squeezing
at different environments. The kinematic performance of flexible robots is thoroughly presented using the large
elastic deflection of a single arm which is actuated by pulling force acting at variable angles and under payload and
friction forces.
Microassembly is an enabling technology to build 3D microsystems consisting of microparts made of different materials and processes. Multiple microparts can be connected together to construct complicated in-plane and out-of-plane microsystems by using compliant mechanical structures such as micro hinges and snap fasteners.
This paper presents design, fabrication, and assembly of an active locking mechanism that provides mechanical and electrical interconnections between mating microparts. The active locking mechanism is composed of thermally actuated Chevron beams and sockets. Assembly by means of an active locking mechanism offers more flexibility in designing microgrippers as it reduces or minimizes mating force, which is one of the main reasons causing fractures in a microgripper during microassembly operation.
Microgrippers, microparts, and active locking mechanisms were fabricated on a silicon substrate using the deep reactive ion etching (DRIE) processes with 100-um thick silicon on insulator (SOI) wafers. A precision robotic assembly platform with a dual microscope vision system was used to automate the manipulation and assembly processes of microparts. The assembly sequence includes (1) tether breaking and picking up of a micropart by using an electrothermally actuated microgripper, (2) opening of a socket area for zero-force insertion, (3) a series of translation and rotation of a mating micropart to align it onto the socket, (4) insertion of a micropart into the socket, and (5) deactivation and releasing of locking fingers. As a result, the micropart was held vertically to the substrate and locked by the compliance of Chevron beams. Microparts were successfully assembled using the active locking mechanism and the measured normal angle was 89.2°. This active locking mechanism provides mechanical and electrical interconnections, and it can potentially be used to implement a reconfigurable microrobot that requires complex assembly of multiple links and joints.
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