An on-package optical interconnect design is proposed for the first time, with silicon photonics in conjunction with the polymer-on-glass interposer technology to enable heterogeneous integration. Glass substrates are used for low-cost, high reliability packaging while silicon photonics allows for high-speed modulation and wavelength division multiplexing within a small footprint. By combining silicon-photonic and benzo-cyclobutene-on-glass interposer technologies, we propose a scalable on-package photonic interconnect that can provide data rates >224 Gb / s for medium-reach links. Our proposed interconnect considers microring modulators and high-speed detectors available in photonic-foundry processes. We present the power-budget analysis to identify the key limiting parameters toward achieving an energy consumption of < 1 pJ / bit.
We propose an interconnect model for multi-chip modules based on integration of a silicon photonic chip with single-mode polymer waveguides fabricated on the low-cost glass interposer technology. We present a detailed power-budget analysis of the on-chip photonic interconnect capable of 1 Tb/s chip-to-chip interconnection bandwidth. For this analysis, we consider state-of-the art photonics foundry modulators and detectors. We also discuss efficient-coupling strategies between the interconnect waveguides and the silicon photonic chip. Our analysis identifies key design parameters impacting the overall performance of the proposed interconnection approach in terms of energy-consumption, distance, and bandwidth and compare its performance with alternative approaches.
Increased electric field breakdown in several polymer-based capacitor dielectrics, including biaxially oriented polypropylene, has been demonstrated using electron and hole blocking layers. Increased electric field breakdown translates into increased energy density. Presented here is work that includes using these blocking layers for a new capacitor dielectric material with a high permittivity (K). Initial results are promising, increasing the potential for even higher energy density polymer capacitors.
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