Mr. Muhammet Burak Baran Profile

Muhammet Burak Baran

at Sabanc Univ

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Publications (2)

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Proceedings Article | 31 May 2012 Paper

Design and realization of 144 x 7 TDI ROIC with hybrid integrated test structure

Omer Ceylan, Huseyin Kayahan, Melik Yazici, Muhammet Burak Baran, Yasar Gurbuz

Proceedings Volume 8353, 83531Q (2012) https://doi.org/10.1117/12.920370

KEYWORDS: Readout integrated circuits, Sensors, Capacitors, Transistors, Imaging systems, Digital electronics, Amplifiers, Cryogenics, Infrared imaging, Staring arrays

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Design and realization of a 144x7 silicon readout integrated circuit (ROIC) based on switched capacitor TDI for MCT LWIR scanning type focal plane arrays (FPAs) and its corresponding hybrid integrated test circuits are presented. TDI operation with 7 detectors improves the SNR of the system by a factor of √7, while oversampling rate of 3 improves the spatial resolution of the system. ROIC supports bidirectional scan, 5 adjustable gain settings, bypass operation, automatic gain adjustment in case of mulfunctioning pixels and pixel select/deselect properties. Integration time of the system can be determined by the help of an external clock. Programming of ROIC can be done in parallel or serial mode according to the needs of the system. All properties except pixel select/deselect property can be performed in parallel mode, while pixel select/deselect property can be performed only in serial mode. ROIC can handle up to 3.75V dynamic range with a load of 25pF and output settling time of 80ns. Input referred noise of the ROIC is less than 750 rms electrons, while the power consumption is less than 100mW. To test ROIC in absence of detector array, a process and temperature compensated current reference array, which supplies uniform input current in range of 1-50nA to ROIC, is designed and measured both in room and cryogenic (77ºK) temperatures. Standard deviations of current reference arrays are measured 3.26% for 1nA and 0.99% for 50nA. ROIC and current reference array are fabricated seperately, and then flip-chip bonded for the test of the system. Flip-chip bonded system including ROIC and current reference test array is successfully measured both in room and cryogenic temperatures, and measurement results are presented. The manufacturing technology is 0.35μm, double poly-Si, four metal, 5V CMOS process.

Proceedings Article | 21 May 2011 Paper

Design of ROIC based on switched capacitor TDI for MCT LWIR focal plane arrays

Huseyin Kayahan, Melik Yazici, Omer Ceylan, Muhammet Baran, Yasar Gurbuz

Proceedings Volume 8012, 80120M (2011) https://doi.org/10.1117/12.883951

KEYWORDS: Capacitors, Readout integrated circuits, Sensors, Temperature metrology, Switches, Digital electronics, Amplifiers, Cryogenics, CMOS technology, Long wavelength infrared

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Design and measurement of a silicon readout integrated circuit (ROIC) based on switched capacitor time delay integration (TDI) technique for LWIR HgCdTe Focal Plane is presented. ROIC incorporates time delay integration (TDI) functionality for scanning type of detector by using switched capacitor technique with a supersampling rate of three, increasing SNR and the spatial resolution. ROIC, in terms of functionality, is capable of bidirectional scan, programmable integration time, 5 gain settings at the input and auto gain adjustment with pixel deselection capability. Programming can be done parallel or serially with test mode functionality. ROIC can handle up to 3.75V dynamic range with the load being 25pF capacitive, output settling time is less than 80 nsec. This low power ROIC consumes less than 100mW. Moreover, input referred noise is less than 750 rms electrons. Simulations and measurements are done in both room temperature and cryogenic (77 °K) temperatures. In order to measure and simulate chip without a detector, process and temperature invariant current source block that imitate detector currents are designed as well. The manufacturing technology is 0.35μm, double poly-Si, four-metal (3 metals and 1 top metal) 5V CMOS process.

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