Naya Ha
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 29 March 2013 Paper
Jae-Hyun Kang, Byung-Moo Kim, Naya Ha, Hung bok Choi , Kee sup Kim , Sarah Mohamed, Kareem Madkour, Wael ElManhawy, Evan Lee, Jean-Marie Brunet, Joe Kwan
Proceedings Volume 8684, 86840N (2013) https://doi.org/10.1117/12.2011619
KEYWORDS: Lithography, Double patterning technology, Design for manufacturing, Resolution enhancement technologies, Manufacturing, Bridges, Visualization, Design for manufacturability, Metals, Electronics

Proceedings Article | 15 March 2012 Paper
Jae-Hyun Kang, Naya Ha, Joo-Hyun Park, Byung-Moo Kim, Seung Weon Paek, Hungbok Choi, Kee Sup Kim, Ahmed Mohy, Shady Abdelwahed, Mohamed Imam
Proceedings Volume 8327, 83270P (2012) https://doi.org/10.1117/12.917998
KEYWORDS: Semiconducting wafers, Metals, Process modeling, Image processing, Design for manufacturing, Chemical mechanical planarization, Optical proximity correction, 3D modeling, Photovoltaics, Scanning electron microscopy

Proceedings Article | 15 March 2012 Paper
Daehyun Jang, Naya Ha, Junsu Jeon, Jae-Hyun Kang, Seung Weon Paek, Hungbok Choi, Kee Sup Kim, Ya-Chieh Lai, Philippe Hurat, Wilbur Luo
Proceedings Volume 8327, 83270S (2012) https://doi.org/10.1117/12.916199
KEYWORDS: Silicon, Manufacturing, Lithography, Failure analysis, Data processing, Chemical mechanical planarization, Semiconducting wafers, Design for manufacturability, Tolerancing, Optical lithography

Proceedings Article | 15 March 2012 Open Access Paper
Seung Weon Paek, Jae Hyun Kang, Naya Ha, Byung-Moo Kim, Dae-Hyun Jang, Junsu Jeon, DaeWook Kim, Kun Young Chung, Sung-eun Yu, Joo Hyun Park, SangMin Bae, DongSup Song, WooYoung Noh, YoungDuck Kim, HyunSeok Song, HungBok Choi, Kee Sup Kim, Kyu-Myung Choi, Woonhyuk Choi, JoongWon Jeon, JinWoo Lee, Ki-Su Kim, SeongHo Park, No-Young Chung, KangDuck Lee, YoungKi Hong, BongSeok Kim
Proceedings Volume 8327, 832704 (2012) https://doi.org/10.1117/12.920029
KEYWORDS: Design for manufacturing, Silicon, Polishing, Optical proximity correction, Back end of line, Metals, Failure analysis, Yield improvement, Logic, Manufacturing

Proceedings Article | 5 April 2011 Paper
Naya Ha, Jinwoo Lee, S. W. Paek, Kee Sup Kim, Kuang Han Chen, Aaron Gower-Hall, Tamba Gbondo-Tugbawa, Philippe Hurat
Proceedings Volume 7974, 79740W (2011) https://doi.org/10.1117/12.880899
KEYWORDS: Chemical mechanical planarization, Metals, Copper, System on a chip, Design for manufacturing, Manufacturing, Dielectrics, Polishing, Device simulation, Logic

Showing 5 of 6 publications
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