Naya Ha
at SAMSUNG Electronics Co Ltd
SPIE Involvement:
Author
Publications (6)

Proceedings Article | 29 March 2013 Paper
Proc. SPIE. 8684, Design for Manufacturability through Design-Process Integration VII
KEYWORDS: Lithography, Electronics, Visualization, Metals, Manufacturing, Bridges, Design for manufacturing, Double patterning technology, Resolution enhancement technologies, Design for manufacturability

Proceedings Article | 15 March 2012 Paper
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Polishing, Logic, Metals, Silicon, Manufacturing, Design for manufacturing, Optical proximity correction, Failure analysis, Yield improvement, Back end of line

Proceedings Article | 15 March 2012 Paper
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Photovoltaics, Metals, Image processing, 3D modeling, Scanning electron microscopy, Design for manufacturing, Optical proximity correction, Semiconducting wafers, Process modeling, Chemical mechanical planarization

Proceedings Article | 15 March 2012 Paper
Proc. SPIE. 8327, Design for Manufacturability through Design-Process Integration VI
KEYWORDS: Lithography, Optical lithography, Silicon, Manufacturing, Data processing, Semiconducting wafers, Tolerancing, Failure analysis, Chemical mechanical planarization, Design for manufacturability

Proceedings Article | 5 April 2011 Paper
Proc. SPIE. 7974, Design for Manufacturability through Design-Process Integration V
KEYWORDS: Polishing, Logic, Metals, Copper, Dielectrics, Manufacturing, Design for manufacturing, System on a chip, Device simulation, Chemical mechanical planarization

Showing 5 of 6 publications
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