Mr. Neal Callan Profile

Neal Callan

Vice President Fab Products at ASML

SPIE Involvement:

Author

Proceedings Article | 8 March 2016 Paper

Process window limiting hot spot monitoring for high-volume manufacturing

Marinus Jochemsen, Roy Anunciado, Vadim Timoshkov, Stefan Hunsche, Xinjian Zhou, Chris Jones, Neal Callan

Proceedings Volume 9778, 97781R (2016) https://doi.org/10.1117/12.2219906

KEYWORDS: Semiconducting wafers, Data modeling, Metrology, Defect detection, High volume manufacturing, Deep ultraviolet, Inspection, Detection and tracking algorithms, Process control, Etching, Optical lithography, Scanning electron microscopy, Sensors, Lithography, Scanners

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Proceedings Article | 4 December 2008 Paper

An innovative Source-Mask co-Optimization (SMO) method for extending low k1 imaging

Stephen Hsu, Luoqi Chen, Zhipan Li, Sean Park, Keith Gronlund, Hua-Yu Liu, Neal Callan, Robert Socha, Steve Hansen

Proceedings Volume 7140, 714010 (2008) https://doi.org/10.1117/12.806657

KEYWORDS: Diffractive optical elements, Photomasks, Source mask optimization, Atrial fibrillation, Optical proximity correction, Fiber optic illuminators, Nanoimprint lithography, Scanners, Electroluminescence, Lithography

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Proceedings Article | 6 December 2004 Paper

Qualifying OPC model robustness to reticle noise errors and FAB process changes

Diane Keil, Nadya Belova, John Jensen, Neal Callan

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569580

KEYWORDS: Optical proximity correction, Reticles, Data modeling, Logic, Semiconducting wafers, Performance modeling, Lithography, Image processing, Tolerancing, Scanning electron microscopy

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Proceedings Article | 6 December 2004 Paper

Simple method for restricting OPC model minimum spacing and width for a no-failure imaging solution

Nadya Belova, Neal Callan

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.569640

KEYWORDS: Optical proximity correction, Reticles, Scanning electron microscopy, Logic, Semiconducting wafers, Control systems, Photomasks, Fourier transforms, Metals, Prototyping

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Proceedings Article | 6 December 2004 Paper

Sensitivity of the 65-nm polyline printability to sPSM manufacturing errors

Nadya Belova, John Jensen, Ebo Croffie, Neal Callan

Proceedings Volume 5567, (2004) https://doi.org/10.1117/12.570283

KEYWORDS: Reticles, Error analysis, Critical dimension metrology, Statistical analysis, Photomasks, Manufacturing, Monte Carlo methods, Semiconducting wafers, Computer simulations, Phase shifts

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Proceedings Article | 28 May 2004 Paper

Analysis of off-axis illumination-based phase-edge/chromeless mask technologies

Ebo Croffie, Kunal Taravade, Neal Callan, Keuntaek Park, Gregory Hughes

Proceedings Volume 5377, (2004) https://doi.org/10.1117/12.536172

KEYWORDS: Photomasks, Reticles, Data conversion, Semiconducting wafers, Manufacturing, Lithography, Printing, Scanning electron microscopy, Phase shifts, Lithographic illumination

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Proceedings Article | 17 December 2003 Paper

OPC model generation procedure for different reticle vendors

Andrew Jost, Nadya Belova, Neal Callan

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518219

KEYWORDS: Reticles, Optical proximity correction, Data modeling, Semiconducting wafers, Statistical modeling, Manufacturing, Quartz, Critical dimension metrology, Logic, Cadmium

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Proceedings Article | 17 December 2003 Paper

Analysis of etched quartz solutions for 65-nm node critical layer lithography

Ebo Croffie, Neal Callan

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518322

KEYWORDS: Photomasks, Semiconducting wafers, Lithography, Quartz, Calibration, System on a chip, Manufacturing, Data conversion, Phase shifts, SRAF

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Proceedings Article | 17 December 2003 Paper

Multichip reticle approach for OPC model verification

Kunal Taravade, Nadya Belova, Andrew Jost, Neal Callan

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518217

KEYWORDS: Optical proximity correction, Reticles, Semiconducting wafers, Logic, Metals, Inspection, Performance modeling, Photomasks, Manufacturing, Lithography

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Proceedings Article | 17 December 2003 Paper

Application of rigorous electromagnetic simulation to SLM-based maskless lithography for 65-nm node

Ebo Croffie, Nick Eib, Neal Callan, Nabila Baba-Ali, Azat Latypov, Jason Hintersteiner, Torbjorn Sandstrom, Arno Bleeker, Kevin Cummings

Proceedings Volume 5256, (2003) https://doi.org/10.1117/12.518747

KEYWORDS: Mirrors, Spatial light modulators, Diffraction, Light scattering, Maskless lithography, Near field, Electromagnetism, Photomasks, Imaging systems, Electromagnetic scattering

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Proceedings Article | 2 July 2003 Paper

Electrical validation of resolution enhancement techniques

Kunal Taravade, Neal Callan, Ebo Croffie, Aftab Ahmad

Proceedings Volume 5043, (2003) https://doi.org/10.1117/12.485275

KEYWORDS: Optical proximity correction, Resolution enhancement technologies, Semiconducting wafers, Reticles, Transistors, Scanning electron microscopy, Manufacturing, Performance modeling, Tolerancing, Instrument modeling

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Proceedings Article | 26 June 2003 Paper

Dark-field high-transmission chromeless lithography

George Bailey, Neal Callan, Kunal Taravade, John Jensen, Benjamin Eynon, Patrick Martin, Henry Kamberian, Darren Taylor, Rick Farnbach

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485518

KEYWORDS: Photomasks, Opacity, Scattering, Lithography, Diffraction gratings, Scanning electron microscopy, Manufacturing, Attenuators, Finite element methods, Optical design

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Proceedings Article | 27 December 2002 Paper

Reticle defect management solutions for a wafer fab

Robert Muller, Glen Scheid, Neal Callan

Proceedings Volume 4889, (2002) https://doi.org/10.1117/12.467850

KEYWORDS: Reticles, Inspection, Logic, Semiconducting wafers, Photomasks, Defect inspection, Image classification, Classification systems, Silicon, Contamination

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Proceedings Article | 29 June 1998 Paper

Lithographic evaluation of a new high-performance photoresist composition

Warren Montgomery, Neal Callan, Alan Kozlowski

Proceedings Volume 3333, (1998) https://doi.org/10.1117/12.312353

KEYWORDS: Photoresist materials, Lithography, Critical dimension metrology, Manufacturing, Photoresist processing, Photomasks, Structural design, Metals, Industrial chemicals, Semiconducting wafers

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Showing 5 of 14 publications

Conference Committee Involvement (1)

Cost and Performance in Integrated Circuit Creation

27 February 2003 | Santa Clara, CA, United States

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