Non-linear ionization is the physical excitation mechanism by which an ultrashort laser locally transforms a dielectric from an initial insulating to a highly conductive state with considerable changes on its local electrical and optical properties. When controlled, this local excitation of the material yields well-calibrated macroscopic post-mortem transformation on which every optimized process of laser micromachining builds on. The work presented here is part of this perspective to get control of such laser-induced transformation, aiming to propose an accurate experimental evaluation of laser energy deposition at the surface of a dielectric material exposed to ultrashort pulses, and in particular of its produced free-electron – hole plasma density. For that objective, we conceive appropriate single-shot energy balance experiments with specifically designed dielectric targets consisting of wedged and plane-parallel samples of different thickness (below and above the Rayleigh of the focused laser) in order to observe the free-electron hole plasma produced at the dielectric front surface and also to act on the ratio between photo-ionization and total beam losses. Experiments consists in measuring the incident, reflected and transmitted energy on a wide range of incident fluence (<< Fth to ~ Fth, where Fth indicates the laser-induced ablation threshold) by means of calibrated and identical photodiodes in order to establish a precise energy balance of the interaction. We choose fused silica material because of its popularity for micromachining and photonics applications and we also use ultrashort femtosecond pulses ( 15 - 100 fs, 800 nm) to vary the photo-ionization rate and to well decorrelate ionization process from hydrodynamics and any energy transfer and recombination processes. The information retrieved from these experiments and further confronted to Drude-Lorentz theoretical framework helps us understanding ionization processes (photo-ionization, impact ionization) and their respective importance for dielectric macroscopic transformation in the ablation regime.
We demonstrate laser-fabrication of length-controlled channels in the bulk of dielectrics with a spatial periodicity down to 0.7 µm and moderate aspect ratio (1:10), by single-shot ablation using different (fs/ps) pulse durations. We take advantage of beam shaping technique using an axicon and annular aperture to generate a Bessel beam with an extra control of the so-called “non-diffracting” length. The dimensions and pitch attained are suitable to envision the writing of NIR nanophotonic components. As a proof-of-principle demonstration, we fabricate patterns whose arrangements mimic photonic-crystal devices like waveguide, Y-coupler, and structures with square and triangular lattices as their basic units.
Periodic arrangements of micro- and nano-holes with controllable period, diameter and depth at the surface of materials are of high interest for a large range of applications. Here we present a laser-based approach using micro-Bessel beams with adjustable length to machine arrays of holes with subwavelength diameters and depths reaching several micrometers at the surface of fused silica. Suitability and limitations of the technique are investigated, including the challenge of avoiding crosstalk effects. The performance level shows the potential of the direct-laser-processing method towards the realization of integrated devices, as a flexible and cost-effective alternative technique to current multistep nanofabrication methods.
Arrays of nanoholes or nanochannels constitute the building block of integrated devices that open attractive applications like 2D photonic crystals, 2D metamaterials or nanostructured surfaces. Here we present a laser-based technique that enables to generate short-length micro-Bessel beams (irrespective of their core diameter) that we further use to machine depth-controlled holes with a cylindrical depth profile. We illustrate the potential of this method by fabricating square arrays of subwavelength-diameter holes with several-micrometers depth by direct laser ablation at the surface of fused silica.
We present a complete study, together with a careful experimental metrology, on single shot ablation of fused silica and sapphire induced by femtosecond pulses (<200-fs) ranging from 258 nm to 2000 nm. The wavelength-dependent fluence ablation threshold, increasing up to near infrared and saturating on the infrared range, allows to infer the role of drastically changing photoionization rates following Keldysh formalism. While it is also expected an energy deposition primarily relying on electron heating and avalanche in the infrared, we find deep craters are more efficiently obtained near the ablation threshold but the difference rapidly vanishes at increased fluences.
We develop an experiment of laser-matter interaction in air environment with ultrashort pulses of 12 fs in the context of micromachining. From post-mortem analysis of the sample, we determine the ablation thresholds of fused silica and sapphire exposed to single 12-fs laser pulse. We also analyze the evolution of macroscopic ablation quantities, taking into account the role of nonlinear propagation effects in air prior the target.
We present the development of a laser damage and ablation test-bench able to accommodate ultrashort pulses down to 10
fs pulse duration. The laser test-bench is operated in air and we demonstrate its capability to accurately measure the
damage and ablation characteristics of optical materials, like fused silica, irradiated by single ultrashort pulses of < 15 fs
pulse duration. The careful characterization of beam propagation allows us to ascertain the precise retrieval of laserinduced
damage and ablation threshold fluences as well as to identify the energetic regime yielding to beam
filamentation.
The metrology of laser damage is essential for the development of intense laser chains and their applications, especially
in micromachining. We first present a test bench able to accurately measure the damage and ablation behaviour of
optical materials and components irradiated by femtosecond lasers (< 15 fs - 5 ps). We further illustrate the interest of
our measurements through examples related to laser technology and engineering, and also fundamental knowledge of
laser-matter interaction.
Results of laser induced damage threshold (LIDT) of fused silica, sapphire and Ti:Sa crystals in single shot mode in the femtosecond regime down to few optical cycles (< 10 fs) are presented. Different approaches to determine LIDT are described and compared. Our methodology yields accurate determination of damage/ablation threshold of any material (or component) irradiated by pulsed laser, as well as complementary physical results characterizing laser–matter interaction and/or concerning the deterministic character of femtosecond damage. It is shown that the abrupt decrease of both damage and ablation thresholds observed with ultra-short pulses (< 30 fs) is related to the significance of tunnel ionization in the ultrashort regime. Moreover, the results indicate that the laser damage occurrence is more deterministic below 30 fs.
3D laser microfabrication inside narrow band gap solids like semiconductors will require the use of long wavelength
intense pulses. We perform an experimental study of the multiphoton-avalanche absorption yields and thresholds with tightly focused femtosecond laser beams at wavelengths: 1.3μm and 2.2μm. For comparisons, we perform the experiments in two very different materials: silicon (semiconductor, ∼1.1 eV indirect bandgap) and fused silica (dielectric, ∼9 eV direct bandgap). For both materials, we find only moderate differences while the number of photons required to cross the band gap changes from 2 to 3 in silicon and from 10 to 16 in fused silica.
We present experimental and theoretical investigations of interaction of a femtosecond laser (450 fs pulse at 1025nm)
with dielectric materials (fused silica) for the single-shot laser regime. The aim is to analyze and understand the complex
physical mechanisms of laser energy absorption yielding to damage and /or ablation. We outline the distinction between
the ablation and the damage thresholds for dielectric materials. The evolution of the reflection, transmission and
absorption signals is studied as a function of fluence. The experimental curves are accompanied by a modelling, which
takes into account the photoionization and avalanche ionization depicting absorption of the laser energy by the material.
The incident pulse propagation into the material, the temporal evolution of the electron density, reflection and
transmission illustrate the beginning and the duration of the laser pulse absorption. The magnitude of the absorption
process is energy density sensitive and, with the increase of the deposited fluence, the onset of absorption is moved
temporally to the beginning of the pulse. We show the influence of the effective electron collision frequency on the
calculated values of reflection, transmission and absorption. The results are particularly relevant to high micromachining
industrial processes.
We present a coupled study of laser-induced damage and ablation of fused silica in the femtosecond regime. Both
thresholds are essentially different and investigations under a wide excursion of pulse duration (< 10 fs to 300 fs) and
applied fluence (Fth < F < 10 Fth) provide quantitative knowledge on i) the strength of the so-called "deterministic"
character of femtosecond laser damaging, linked to ionization mechanisms ; ii) the physical characteristics of surface
ablation craters demonstrating that high selectivity and nanometric resolution is achievable.
The use of large Ti:Sapphire crystals in ultra fast high peak power laser amplifiers makes crucial the problem of
crystal laser induced damage. These works aim to quantify the laser induced damage threshold (LIDT) of Sapphire and
Ti:Sapphire crystals under femtosecond, picosecond and nanosecond laser pulse irradiations, which are typically
encountered in such laser chains. Furthermore, a study of the influence of cryogenic conditions on the LIDT of
Ti:Sapphire crystals and of their anti-reflection coating has been performed. The results are important to understand the
mechanisms leading to the damage, and to reveal the key parameters which will have to be optimized in future high peak
power laser chains.
In this paper, we are focused on the understanding the underlying physical mechanisms of femtosecond laser interactions
with metallic and multi-layer optical materials. The results of the numerical modeling provide an estimation of damage
and/or ablation threshold for different laser parameters (pulse duration, fluence, angle of incidence, polarization) and
target material properties (metal, dielectric, or multilayer with variable metal layer thickness). These results are
compared with the experimental measurements of the thresholds obtained by using different techniques. In particular,
dielectric ionization and ablation mechanisms are analyzed based on the experimental findings.
In this work, spot-size dependence of surface femtosecond laser-induced damage threshold in fused silica is put in
evidence when the damage reach the micrometer scale. Measurements of the threshold with various numerical apertures
and different techniques are performed, revealing a noticeable threshold increase while decreasing the laser beam-focus
size below ~10 μm. This unexpected result could be explained by the presence of micrometer-sized defects pre-existing
in the SiO2 sample.
We present programmable focal spot shaping of amplified femtosecond laser pulses by use of an optically
addressed non-pixellated liquid crystal light valve. This extra-cavity phase filtering method is set-up in the frame of
femtosecond micromachining processes. Various focal spot shapes are demonstrated together with drilling and
marking results in metals and dielectrics. Photowriting of waveguides in bulk fused silica is also presented.
We propose a versatile set-up dedicated to programmable beam shaping of femtosecond pulses in a focal plane. A non-pixelated liquid-crystal light valve is used as the phase-front modulator. We demonstrate active and adaptive wavefront correction of a 4-μJ, 100-kHz amplified laser chain, where residual wavefront distorsions are decreased down to λ/15 peak-valley and λ/100 rms. The subsequent improvement for micromachining applications is investigated, and diffraction-limited holes are demonstrated on various materials. Moreover, beam patterning in the focal plane is also presented. Theoretical calculations of the required phase modulation are proposed, and experimental shapes are demonstrated, like square and circular top-hats, as well as triangle or doughnut shapes.
We propose an active and adaptative optics device dedicated to programmable femtosecond beam shaping, based on the use of an optically addressed light valve. A theoretical investigation of the system is presented. The experimental set-up incorporating an active beam shaping device, is depicted. Results are then described and discussed.
Due to the rapid development of ultrashort lasers, quality of the machining is of prime interest for several applications. For instance deep marking of various materials. In this case, the depth can be controlled, knowing the ablation rate for the corresponding material. The evolution of ablation rates of Al, Cu and Ni are given in relation to the energy density. In metals the effect of thermal diffusion has to be taken into account to control collateral effects and especially the heat affected zone.
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