Mr. Paul Fortier Profile

Paul Fortier

at IBM Canada

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Author

Publications (4)

Proceedings Article | 28 February 2020 Paper

Packaging challenges for next-generation high bandwidth opto-electrical switch modules

Alexander Janta-Polczynski, Elaine Cyr, Richard Langlois, Nicolas Boyer, Paul Fortier

Proceedings Volume 11286, 1128610 (2020) https://doi.org/10.1117/12.2549959

KEYWORDS: Packaging, Switches, Photonics, Transceivers, Photonic integrated circuits, Connectors, Integrated optics, Interfaces, Modulation

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Proceedings Article | 4 March 2019 Paper

Solder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilities

Alexander Janta-Polczynski, Elaine Cyr, Richard Langlois, Paul Fortier, Yoichi Taira, Nicolas Boyer, Tymon Barwicz

Proceedings Volume 10924, 109240X (2019) https://doi.org/10.1117/12.2514966

KEYWORDS: Design for manufacturing, Photonics, Microelectronics, Packaging, Adhesives, Optical alignment, Single mode fibers, Connectors, Electronics, Reliability

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Single-mode integrated photonics assembly is challenging due to the tight alignment required for optical connections. To address this, we have developed a parallelized fiber assembly process using self-alignment of fiber arrays in V-grooves defined on the photonic chip. This approach is compatible with standard automated high-throughput pick and place tools, thus improving the scalability and cost-efficiency of photonic packaging. We describe our efforts toward increasing the assembly throughput as well as making the photonic connections compatible with high temperatures from downstream microelectronic assembly processes, such as lead-free solder reflows. The ability to survive these higher temperatures allows the pretesting of optical engines and paves the way for true co-integration of photonics and electronics. We have shown that attaching fibers to chips using multiple adhesives with partitioning of their function provides substantial gains in both throughput and reliability at a relatively small cost of dispense complexity. The fibers are tacked in place with lengthy adhesive cures performed in a batch process outside of the placement tool so as not to impact the placement tool’s throughput. This approach allows for strong long term structural integrity along with optimized optical index matching between the fiber and the waveguide coupler of the photonic dies. Not only did we observe the same peak optical performance that we previously reported, but we have also demonstrated no experimentally significant optical penalty after 5x lead-free solder reflows, in operational temperature between -15°C and 150°C and, after aggressive microelectronic environmental stressing going beyond the parameters traditionally used in optics. The ability to embed single mode optics in the first level package is a disruptive capability contributing to enable the high-density interconnects needed to meet the ever-increasing bandwidth demands for data communication. We discuss the benefits of such configurations, as well as the challenges for thermal management and system yields.

Proceedings Article | 23 February 2018 Presentation + Paper

Breaking the mold of photonic packaging

Tymon Barwicz, Ted Lichoulas, Yoichi Taira, Yves Martin, Shotaro Takenobu, Alexander Janta-Polczynski, Hidetoshi Numata, Eddie Kimbrell, Jae-Woong Nah, Bo Peng, Darrell Childers, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Elaine Cyr, Sebastian Engelmann, Paul Fortier, Nicolas Boyer

Proceedings Volume 10535, 105350R (2018) https://doi.org/10.1117/12.2290230

KEYWORDS: Packaging, Silicon photonics, Polymers, Waveguides, Interfaces, Optical alignment

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Proceedings Article | 22 February 2018 Paper

Towards co-packaging of photonics and microelectronics in existing manufacturing facilities

Alexander Janta-Polczynski, Elaine Cyr, Jerome Bougie, Alain Drouin, Richard Langlois, Darrell Childers, Shotaro Takenobu, Yoichi Taira, Ted Lichoulas, Swetha Kamlapurkar, Sebastian Engelmann, Paul Fortier, Nicolas Boyer, Tymon Barwicz

Proceedings Volume 10538, 105380B (2018) https://doi.org/10.1117/12.2291902

KEYWORDS: Photonics, Packaging, Polymers, Microelectronics, Integrated optics, Waveguides, Connectors, Polymer multimode waveguides, Singular optics, Silicon photonics

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