Paul B. Jaynes
Lead Engineer
SPIE Involvement:
Author
Publications (1)

Proceedings Article | 18 May 2006 Paper
Proceedings Volume 6232, 62320M (2006) https://doi.org/10.1117/12.665505
KEYWORDS: Polymers, Sensors, Packaging, Liquid crystals, Dielectrics, Acoustics, Microsystems, Polymer thick film flex circuits, Copper, Telecommunications

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top