InAsSb/AlSb barrier detectors were grown on (100) semi-insulating GaAs substrates by a molecular beam epitaxy. We compare the performance of two detectors with different active layers denoted as p + BppBpN + and p + Bpnn + . InAs0.81Sb0.19 absorber allows to operate up to 5.3-μm cut-off wavelengths at 230 K. p + Bpnn + detector (n-type absorber) exhibits diffusion-limited dark currents above 200 K. AlSb barrier provides low dark currents and suppresses surface leakage currents. With a value of 0.13 A / cm2 at 230 K, the current is of about an order of magnitude larger than determined by the “Rule 07.” Dark currents of p + BppBpN + detector (p-type absorber) are much higher due to a contribution of Shockley–Read–Hall mechanisms. On the other hand, a device with a p-type absorber exhibits the highest value of current responsivity, up to 2.5 A / W, pointing out that there is a tradeoff between dark current performance and quantum efficiency.
An InAsSb/AlSb heterostructure photovoltaic detector structures were grown on a (100) semi-insulating GaAs substrates by a molecular beam epitaxy. We compare the performance of two detectors with a different type of absorbing layers, denoted p+BppBpn+ and p+Bpnn+. InAs0.81Sb0.19 absorption layers allow for a operation up to 5.3 μm cut-off wavelengths at 230 K. p+Bpnn+ detector (n-type absorber) exhibits diffusion-limited dark currents above 200 K. AlSb barrier provides a low values of dark currents and allows a suppression of surface leakage current. With a value of 0.13 A/cm2 at 230 K, the current is less than an order of magnitude larger than those determined by the "Rule 07" for HgCdTe detectors. Dark currents of p+BppBpN+ detector (p-type absorber) are much higher due to a contribution of Shockley-Read-Hall mechanisms. On the other hand, device with a p-type absorber shows highest values of current responsivity, up to 2.5 A/W, point out that there is a trade-off between dark current performance and quantum efficiency.
The paper reports on the long-wave (λc = 8.05−11 μm) HgCdTe (Cd composition, xCd = 0.17−0.2) infrared detector for ultra short response time operating for unbiased condition and room temperature (300 K). The optimal structure in terms of the short response time versus device architecture was shown. The response time of the long-wave (xCd = 0.17−0.2) HgCdTe detector for 300 K was calculated at the level of τs ~ 400−440 ns for zero bias condition and lack of the extra series resistance. It was presented that extra series resistance related to the processing (in the range ~ 0−20 Ω) extends response time within the range τs ~ 650−800 ps for active layer xCd = 0.2.
The preliminary results of quantitative mobility spectrum analysis of highly iodine-doped Hg0,685Cd0,315Te and arsenicdoped Hg0,827Cd0,173Te for the 5 – 300 K temperature range have been presented. Electron mobilities for the samples made by metalorganic chemical vapor deposition technique have been compared with the available literature data.
Theoretical and experimental investigations on the response time improvement of unbiased long-wave infrared (LWIR) HgCdTe detectors operating at temperatures T=230 K were presented. Metal–organic chemical vapor deposition technology is an excellent tool in fabrication of different HgCdTe detector structures with a wide range of composition and donor/acceptor doping and without postgrown ex-situ annealing. The time constant is lower in biased detectors due to Auger-suppression phenomena and reduction of diffusion capacitance related to a wider depletion region. The relatively high bias current requirements and excessive low-frequency noise, which reduces the detectivity of biased detectors, inspire research on the time constant improvement of unbiased detectors. The response time of high-operating temperature LWIR HgCdTe detectors revealed complex behavior being dependent on the applied reverse bias, the operating temperature, the absorber thickness and doping, the series resistance, and the electrical area of the devices. The response time of 2 ns was achieved for unbiased 30×30 μm HgCdTe structures with λ50%=10.6 μm operating at T=230 K.
Theoretical and experimental investigations on the response time improvement of biased and unbiased long-wave infrared (LWIR) HgCdTe detectors operating at temperatures T = 230K were presented in this paper. MOCVD technology is an excellent tool in fabrication of different HgCdTe detector structures with a wide range of composition, donor/acceptor doping and without post grown ex-situ annealing. Donor doping efficiency in (111) and (100) oriented HgCdTe layers has been discussed. The time constant is lower in biased detectors due to Auger suppression phenomena and reduction of diffusion capacitance related to wider depletion region. The relatively high bias currents requirements and excessive low frequency noise which reduces the detectivity of biased detectors inspire researches on the time constant improvement of unbiased detectors. The response time of high-operating temperature (HOT) LWIR HgCdTe detectors revealed complex behavior being dependent on the applied the reverse bias, the operating temperature, the absorber thickness and doping, the series resistance and the electrical area of the devices.
We present progress in metal organic chemical vapor deposition (MOCVD) growth of (100) HgCdTe epilayers achieved recently at the Institute of Applied Physics, Military University of Technology and Vigo System S.A. It is shown that MOCVD technology is an excellent tool for the fabrication of different HgCdTe detector structures with a wide range of composition, donor/acceptor doping, and without post grown ex-situ annealing. Surface morphology, residual background concentration, and acceptor doping efficiency are compared in (111) and (100) oriented HgCdTe epilayers. At elevated temperatures, the carrier lifetime in measured p-type photoresistors is determined by Auger 7 process with about one order of magnitude difference between theoretical and experimental values. Particular progress has been achieved in the growth of (100) HgCdTe epilayers for medium wavelength infrared photoconductors operated in high-operating temperature conditions.
In this paper we present progress in MOCVD growth of (100) HgCdTe epilayers achieved recently at the Institute of
Applied Physics, Military University of Technology and Vigo System S.A. It is shown that MOCVD technology is an
excellent tool in fabrication of different HgCdTe detector structures with a wide range of composition, donor/acceptor
doping and without post grown annealing.
Particular progress has been achieved in the growth of (100) HgCdTe epilayers for long wavelength infrared
photoconductors operated in HOT conditions. The (100) HgCdTe photoconductor optimized for 13-μm attain detectivity
equal to 6.5x109 Jones and therefore outperform its (111) counterpart.
The paper also presents technological progress in fabrication of MOCVD-grown (111) HgCdTe barrier detectors.
The barrier device performance is comparable with state-of-the-art of HgCdTe photodiodes. The detectivity of HgCdTe
detectors is close to the value marked HgCdTe photodiodes. Dark current densities are close to the values given by “Rule
07”.
In the last decade, new architecture designs such as nBn devices or unipolar barrier photodiodes have been proposed to achieve high-operating temperature (HOT) detectors. This idea has been also implemented in HgCdTe ternary material systems. However, the implementation of this detector structure in an HgCdTe material system is not straightforward due to the existence of a valence band discontinuity (barrier) at the absorber-barrier interface. We report on midwavelength infrared HgCdTe barrier detectors with a zero valence band offset, grown by metal organic chemical vapor deposition on GaAs substrates. The experiments indicate the influence of the barrier on the electrical and optical performances of the p+BpnN+ device. The devices exhibit very low-dark current densities in the range of (2−3)×10−3 A/cm2 at 230 K and a high-current responsivity of about 2 A/W in the wide range of reverse bias voltage. The estimated thermal activation energy of about 0.33 eV is close to the full Hg0.64Cd0.36Te bandgap, which indicates diffusion limited dark currents.
The work reports on mid-wavelength infrared HgCdTe barrier detectors with a zero valence band offset, grown by metal organic chemical vapour deposition on GaAs substrates. The experiments indicate the influence of the barrier on electrical and optical performances of the p+BnN+ device. The devices exhibit very low dark current densities in the range of (2÷3)×10–3 A/cm2 at 300 K and a high current responsivity of about 2A/W in the wide range of reverse bias voltage. The estimated thermal activation energy of about 0.33 eV is close to the full Hg0.64Cd0.36Te bandgap, what indicates diffusion limited dark currents.
The performance of midwavelength infrared type II superllatice InAs/GaSb PIN and nBn (AlGaSb barrier) photodetectors in a reverse bias voltage range and a temperature range from 77 to 240 K is described. The PIN and nBn structures are modeled by a bulk based model, i.e., type II superllatice is treated as an artificial semiconductor material where parameters describing its physical properties are extracted from the experimental data. The model assumes that position of the effective trap energy level depends on temperature, what allowed to obtain a very good fitting to the measurements. Temperature and bias dependent dark current and differential resistance area product of the both devices have been analyzed to investigate contributing mechanisms such as: diffusion, generation-recombination, band-to-band and trap-assisted tunneling that limit the electrical performance of both types of the detectors. The I−V and RA(V) product characteristics of both types of type II superllatice InAs/GaSb photodetectors were found to be dominated by diffusion and generation-recombination currents in the nearly zero-bias region. At medium values of reverse bias, the trap-assisted tunneling reveals its significance, while at higher reverse voltages—the band-to-band tunneling is decisive to I−V and RA(V) characteristics. The fitting procedure allowed to extract both generation-recombination and diffusion components of carrier lifetimes pointing out that the carrier lifetimes range from 2 to 10 ns at T=200 K . Detectivity for T=240 K and V=50 mV was estimated to be 10 9 cmHz 1/2 /W and 4×10 9 cmHz 1/2 /W for PIN and nBn detector, respectively. Finally, type II superlattice InAs/GaSb PIN and nBn structures’ performance is compared to both unipolar barrier nBn HgCdTe detector and bulk HgCdTe photodiodes operated at near-room temperature. It is shown that the performance of SL and HgCdTe photo detectors with a cut-off of about 5 μm is comparable at operation temperatures around 240 K.
We report on temperature dependence characteristics of medium wavelength InAs/GaSb type-II superlattice p-i-n and
nBn photodetectors in a temperature range from 77 K to 300 K. A bulk based model with an effective band gap of
superlattice material has been used in modeling of the experimental data. Temperature dependence and bias dependent
dark current and dynamic resistance of the devices have been analyzed in detail to investigate contributing mechanisms
that limit the electrical performance of the detectors.
The I-V and RA(V) characteristics of both types of detectors (p-i-n and nBn structures) are dominated by diffusion
and generation-recombination currents in the zero-bias and the low-bias regions. At medium values of reverse bias, the
dark current is mostly due to trap-assisted tunneling. At high values of reverse bias, the bulk band-to-band tunneling
dominates. A good fitting of theoretical predictions with experimental data in a wide range of bias voltages and
temperatures has been possible assuming that the position of trap-assisted tunneling level depends on temperature. The
temperature dependence of trap level position can be explained by its less sensitivity on temperature changes in
comparison with superlattice miniband edges. Between room temperature and 200 K the generation-recombination
component and the diffusion component of carrier lifetimes are similar and have shown values about 2-10 ns. At a lower
temperature the diffusion lifetime is longer and increases to about 100 ns for p-i-n structures.
Experimental results concerned morphology improvement of HgCdTe layers grown by MOCVD on GaAs substrates are
presented. Selected growth parameters on morphology state have been discussed. The substrate issues like its quality and
crystallographic orientation as well as misorientation play considerable role in final layer smoothness. We study HgCdTe
layer thickness on its surface roughness. The MBE/MOCVD combination method had been adopted for CdTe buffer
layer deposition.
Extensive characterization studies using accessible equipment and methods: atomic force microscopy (AFM), secondary
electron microscopy (SEM), laser scatterometer and Nomarski microscopy have provided invaluable information about
the connection between defect formation and the influence of specific growth parameters.
We report here the recent progress at VIGO/MUT (Military University of Technology) MOCVD Laboratory in the growth of Hg1-xCdxTe multilayer heterostructures for various types of uncooled infrared devices. The detectors are optimized for any wavelength within 1-12 μm spectral range. Hg1-xCdxTe growth with interdiffused multilayer process (IMP) technique has been improved. The total flow of the carrier gas was optimized to improve lateral uniformity of the composition and doping. The parasitic transient stages between the CdTe and HgTe phases were reduced to reasonable minimum. As a result, we were able to grow layers with homogeneous composition and doping, characterized by steep interfaces. The additional benefits were improved morphology, reduced dislocation density, and minimized consumption of precursors. The other issues addressed in this work were growth of heavy As-doped low-x and heavy Idoped high-x materials. Special modification to IMP process has been applied for in-situ control of stoichiometry. To maintain low vacancy concentration, special growth finish procedure has been developed. No post-growth thermal anneal was necessary for device-quality material. The MOCVD grown heterostructures have been successfully used for advanced uncooled infrared photodetectors such as multiple heterojunction photodiodes, multicolor and specially shaped spectral response multiabsorber devices.
Recent progress at VIGO/MUT (Military University of Technology) MOCVD Laboratory in the growth of Hg1-xCdxTe (HgCdTe) multilayer heterostructures on GaAs/CdTe substrates for uncooled infrared photodetectors is presented. The optimum conditions for the growth of single layers and complex multilayer heterostructures have been established. One of the crucial stages of HgCdTe epitaxy is CdTe nucleation on GaAs substrate. Successful composite substrates have been obtained with suitable substrate preparation, liner and susceptor treatment, proper control of background fluxes and appropriate nucleation conditions. The other critical stage is the interdiffused multilayer process (IMP). The growth of device-quality HgCdTe heterostructures requires complete homogenization of CdTe-HgTe pairs preserving at the same time suitable sharpness of composition and doping profiles. This requires for IMP pairs to be very thin and grown in a short time. Arsenic and iodine have been used for acceptor and donor doping. Suitable growth conditions and post growth anneal is essential for stable and reproducible doping. In situ anneal seems to be sufficient for iodine doping at any required level. In contrast, efficient As doping with near 100% activation requires ex situ anneal at near saturated mercury vapors. As a result we are able to grow multilayer fully doped (100) and (111) heterostructures for various infrared devices including photoconductors, photoelectromagnetic and photovoltaic detectors. The present generation of uncooled long wavelength infrared devices is based on multijunction photovoltaic devices. Near-BLIP performance is possible at ≈ 230 K with optical immersion. These devices are especially promising as 7.8-9.5-μm detectors, indicating the potential for achieving detectivities above 109 cmHz1/2/W.
The researches on doping technology in HgCdTe LPE layers has become the crucial aspect concerned infrared photodiodes. This paper reviews incorporation and activation of dopants from IB, IIIA, and VA group as well as native defects in HgCdTe LPE layers grown from Te-rich solution. The work has been focused mainly on medium wavelength and long wavelength p-type layers because there is still a lot to do on this subject while n-type layers technology seems to be well established.
The impurity issues like: segregation, coefficient, the energy and percentage of activation, and quasichemical approaches are discussed in order to explain impurity behaviour. Various kinds of anomalous of the Hall coefficient and electrical conductivity have frequently been experimentally observed, particularly in low band-gap material (x <0.2) with hole concentration less than 1017 cm-3.
This paper describes and assesses growth of Hg1-xCdxTe (MCT) layers by liquid phase epitaxy (LPE) from Te-rich solutions by the tipping (rotating) method. Epitaxial layers with different compositions from x = 0.18 to x = 0.22 and thicknesses from 10 to 20 μm were grown on (111)B oriented CdZnTe substrates. Growth was carried out in the temperature range 460 - 480°C with cooling rates 0.05 - 0.1°C/min and under flowing H2. The attention was paid mainly to the surface morphological quality, good decantation from the layers, uniformity of composition and thickness of films. HgCdTe layers were characterized using different methods: microscopic examinations, infrared microscopic transmission, secondary ion mass spectrometry and scanning electron microscopic measurements. By optimizing the growth parameters and construction of graphite boat it was possible to obtain high quality Hg1-xCdxTe photodiodes.
This paper concerns HgCdTe heterostructure photodiodes for detection of infrared radiation from 8-12micrometers spectral range. Heterostructures were made by liquid phase epitaxy on the CdZnTe substrates. The cap layer of wider energy gap was used to suppress the generation-recombination current from the top contact. P-on-n junctions were placed in the narrow band-gap area close to the graded region. It was accomplished by appropriate selection of the cap layer thickness and adequate choice of parameters of the As diffusion process. Photodiodes were mesa delineated and illuminated through the substrate. Analysis of the impact of p-n junction location within a heterostructure, contact locations and mesa depth on photo diode parameters, was carried out. The experimental results were compared with two-dimensional numerical calculations performed in APSYS.
The material used throughout this study was Mercury Cadmium Telluride (MCT) grown by liquid phase epitaxy (LPE). Due to its special physical and electrical properties, MCT is still one of the most important infrared materials. That's why we are looking for the ways of improving technology and processing and then extracting the best of this material. This article concerns the influence of p-type MCT layer on junction formation during ion etching. To achieve device quality p-type layers, a lot of experiments were performed with annealing of as-grown wafers or adding different quantity of As to the melt. The technological problems with activation of arsenic and with ion etching are shown. Adjusting of parameters of annealing and etching processes allows n-on-p junctions to be formed with a controllable electrical profile. Standard techniques were used to determine optical and electrical parameters of layers.
The successful fabrication of long wavelength Hg1-yCdyTe/Hg1-xCdxTe heterostructures (Y$GTRx) on semi- insulating (111)CdZnTe substrates is presented. The heterostructures consist of a thin 2-5 micrometers layer on n-type 10- 15 micrometers thick HgCdTe epilayer. A novel tipping boat for liquid phase epitaxial growth of mercury cadmium telluride from Te-rich solutions has been proposed. The characterization of double- layer heterostructures was carried out using different methods: microscopic examinations, infrared microscopic transmission, and scanning electron microscopic measurements. Electrical properties were measured in temperature range of 77-300 K using the Van der Pauw arrangement. By optimizing the growth parameters and the construction of graphite boat it was possible to obtain high quality, relatively abrupt Hg1-xCdxTe heterostructures.
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