Current developments are pushing the integration of optical technologies deeper into the architecture of data centers,1 a trend in which co-packaging figures prominently due to its many inherent advantages2, 3. Several materials are used as a basis for these co-packaged platforms, but glass stands out for its many positive properties, such as high thermal and dimensional stability, great optical transparency, excellent high-frequency properties for electric circuits, and extremely low cost. To seize these advantages, we pursued an approach called electro-optical circuit board (EOCB), in which optical and electrical interconnections are realized by glass-integrated optical waveguides and electrical circuits on both sides of the glass board. An ion-exchange technique was developed to integrate low-loss optical single-mode waveguides into large-sized glass boards (457 mm x 303 mm). In the reported work, the next milestone in developing this process was achieved by reducing the diffusion metal mask opening’s width from 6 μm to 3 μm by mask-less laser patterning. These smaller mask opening allow for optical waveguides with a more circular modal field shape resulting in smaller coupling losses to optical fibers. Additionally, the reduction of propagation losses of multi-mode waveguides for wavelengths down to the visible range was achieved. This opens up the field of sensing and quantum application to EOCBs.
We present a new technology which enables the local resolution production of polymer-based micro-optical components, e.g. in photonic 3D packaging systems. The main advantage of this innovative technology is the capability to dispense liquids of a wide viscosity range (200 – 10.000 mPa*s) on a picoliter scale enabling the use of solvent-free liquid polymers. The newly engineered picoliter dispensing system features the possibility to place liquids on substrates with high positioning accuracy and high flexibility of volume variation and shape. The placement of active and passive micro-optical components for photonic packaging plays an important role in improving optical interfaces, especially in data and telecom applications and optical sensor technology. In this work the capability of this picoliter dispensing system is exemplarily demonstrated on single detached microlenses as well as microlens arrays (MLA) using solvent-free, viscous UV curable hybrid polymers OrmoComp® and OrmoClear®FX. The preliminary results of optical characterisations of the fabricated components verify the advantage of this novel technology over competitive manufacturing methods such as inkjet printing in terms of printability of solvent-free polymers since a comparable optical performance can be obtained while saving solvent evaporation steps.
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